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Jan 11 2020

DSP56303VF100 Datasheets| Freescale Semiconductor - NXP| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-DSP56303VF100

Manufacturer Part#:

DSP56303VF100

Product Category:

Embedded - DSP (Digital Signal Processors)

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

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DSP56303VF100

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Description:

IC DSP 24BIT 100MHZ 196-BGA

Datasheet:

DSP56303VF100 Datasheet

Package:

196-LBGA

Quantity:

28430 PCS


DSP56303VF100 Images are for reference only:

DSP56303VF100 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Manufacturer:

Freescale Semiconductor - NXP

Product Category:

Embedded - DSP (Digital Signal Processors)

Series:

DSP563xx

Address Bus Width:

18.0

Barrel Shifter:

Yes

Boundary Scan:

Yes

Clock Frequency-Max:

100.0 MHz

Device Core:

DSP56300

Data Bus Width:

24 bit

Device Input Clock Speed:

100 MHz

External Data Bus Width:

24.0

Format:

FIXED POINT

Frequency:

100 MHz

Interface:

Host Interface, SSI, SCI

Instruction Type:

Fixed Point

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e0

Length:

15.0 mm

Lead Finish:

Tin/Lead/Silver

Lead Shape:

Ball

Low Power Mode:

Yes

Mounting Type:

Surface Mount

Mounting Style:

SMD/SMT

Maximum Clock Frequency:

100 MHz

Number of Bits:

24

Number of Pins:

196

Number of I/Os:

34

Number of Terminals:

196

On-Chip RAM:

24 kB

Operating Temperature-Min:

-40.0°C

Operating Temperature-Max:

100.0°C

Pin Count:

196

PCB changed:

196

Product Type:

DSP - Digital Signal Processors & Controllers

Package / Case:

196-LBGA

Package Style:

GRID ARRAY, LOW PROFILE

Package Shape:

SQUARE

Package Code:

LBGA

Package Body Material:

PLASTIC/EPOXY

Peak Reflow Temperature:

220 °C

Programmability:

No

Program Memory Type:

ROMLess

RAM Size:

24 KB

Surface Mount:

Yes

Seated Height-Max:

1.6 mm

Supply Voltage-Nom:

3.3 V

Supply Voltage-Min:

3.0 V

Supply Voltage-Max:

3.6 V

Supplier Device Package:

196-MAPBGA (15x15)

Type:

Fixed Point

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30 s

Unit Weight:

0.021658 oz

Width:

15.0 mm


Product Features

• 100 million multiply-accumulates per second (MMACS) with a 100 MHz clock at 3.3 V nominal

• Object code compatible with the DSP56000 core with highly parallel instruction set

• Data arithmetic logic unit (Data ALU) with fully pipelined 24 × 24-bit parallel multiplier-accumulator (MAC), 56-bit parallel barrel shifter (fast shift and normalization; bit stream generation and parsing), conditional ALU instructions, and 24-bit or 16-bit arithmetic support under software control

• Program control unit (PCU) with position-independent code (PIC) support, addressing modes optimized for DSP applications (including immediate offsets), internal instruction cache controller, internal memoryexpandable hardware stack, nested hardware DO loops, and fast auto-return interrupts

• Direct memory access (DMA) with six DMA channels supporting internal and external accesses; one-, two-, and three-dimensional transfers (including circular buffering); end-of-block-transfer interrupts; and triggering from interrupt lines and all peripherals

• Phase-lock loop (PLL) allows change of low-power divide factor (DF) without loss of lock and output clock with skew elimination

• Hardware debugging support including on-chip emulation (OnCE‘) module, Joint Test Action Group (JTAG) test access port (TAP)

• Enhanced 8-bit parallel host interface (HI08) supports a variety of buses (for example, ISA) and provides glueless connection to a number of industry-standard microcomputers, microprocessors, and DSPs

• Two enhanced synchronous serial interfaces (ESSI), each with one receiver and three transmitters (allows six-channel home theater)

• Serial communications interface (SCI) with baud rate generator

• Triple timer module

• Up to thirty-four programmable general-purpose input/output (GPIO) pins, depending on which peripherals are enabled

• 192 × 24-bit bootstrap ROM

• 8 K × 24-bit RAM total

• Program RAM, instruction cache, X data RAM, and Y data RAM sizes are programmable

• Data memory expansion to two 256 K × 24-bit word memory spaces using the standard external address lines

• Program memory expansion to one 256 K × 24-bit words memory space using the standard external address lines

• External memory expansion port

• Chip select logic for glueless interface to static random access memory (SRAMs)

• Internal DRAM Controller for glueless interface to dynamic random access memory (DRAMs)

• Very low-power CMOS design

• Wait and Stop low-power standby modes

• Fully static design specified to operate down to 0 Hz (dc)

• Optimized power management circuitry (instruction-dependent, peripheral-dependent, and modedependent)

• 144-pin TQFP package in lead-free or lead-bearing versions

• 196-pin molded array plastic-ball grid array (MAP-BGA) package in lead-free or lead-bearing versions


Applications

• Multi-line voice/data/fax processing

• Video conferencing

• Audio applications

• Control


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991A2

HTSN:

8542310001

SCHEDULE B:

8542310000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Product Compliance

USHTS:

8542310001

CAHTS:

8542310000

CNHTS:

8542319000

JPHTS:

8542310335

KRHTS:

8542311000

MXHTS:

85423102

TARIC:

8542319000

Radiation Hardening:

No


Documents & Media

Datasheets

DSP56303VF100 Datasheet

Environmental Information

NXP RoHS3 Cert

Images

Functional Block Diagram - Large

Functional Block Diagram - Small

Test/Quality Data

Material Composition

RoHS Certificate of Analysis

Statement on EU REACH Provisions


Product Manufacturer

NXP Semiconductor enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries.


Product Range

ARM ® PROCESSORS

ANALOG

POWER ARCHITECTURE ®PROCESSORS

MEDIA AND AUDIO

RF

IDENTIFICATION & SECURITY

Sensors

Wireless

Automotive Products


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

28430

Freescale Semiconductor - NXP

IC DSP 24BIT 100MHZ 196-BGA

DigiKey

0

NXP USA Inc.

IC DSP 24BIT 100MHZ 196-BGA

Mouser

0

NXP Semiconductors

Digital Signal Processors & Controllers - DSP, DSC 100Mhz/100MMACS


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

DSP56303VF100 Popularity by Region 


Market Price Analysis

There is no relevant information available for this part yet. 


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