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TMS320DM642AGDKA5 Datasheets| Texas Instruments| PDF| Price| In Stock

Author: Apogeeweb
Date: 28 Dec 2019
 2046
Embedded - DSP (Digital Signal Processors)

Product Overview

Kynix Part #:

KY32-TMS320DM642AGDKA5

Manufacturer Part#:

TMS320DM642AGDKA5

Product Category:

Embedded - DSP (Digital Signal Processors)

Stock:

Yes

Manufacturer:

Texas Instruments

Click Purchase button to buy original genuine TMS320DM642AGDKA5

Purchase 

Description:

IC FIXED-POINT DSP 548-FCBGA

Datasheet:

TMS320DM642AGDKA5 Datasheet

Package:

548-BFBGA, FCCSPBGA

Quantity:

88 PCS


TMS320DM642AGDKA5 Images are for reference only.

TMS320DM642AGDKA5 Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs) Embedded - DSP (Digital Signal Processors)

Manufacturer

Texas Instruments

Series

TMS320DM64x, DaVinci™

Packaging

Tray

Part Status

Not For New Designs

Type

Fixed Point

Interface

Host Interface, I²C, McASP, McBSP, PCI

Clock Rate

500MHz

Non-Volatile Memory

External

On-Chip RAM

160kB

Voltage - I/O

3.30V

Voltage - Core

1.20V

Operating Temperature

-40°C ~ 105°C (TC)

Mounting Type

Surface Mount

Package / Case

548-BFBGA, FCCSPBGA

Supplier Device Package

548-FC/CSP (23x23)

Base Part Number

TMS320DM642

Mfr Package Description

FCBGA-548

Status

Active

Address Bus Width

23.0

Barrel Shifter

NO

Bit Size

32

Boundary Scan

YES

Clock Frequency-Max

75.19  MHz

External Data Bus Width

64.0

Format

FIXED POINT

Integrated Cache

YES

Internal Bus Architecture

MULTIPLE

JESD-30 Code

S-PBGA-B548

JESD-609 Code

e0

Low Power Mode

YES

Moisture Sensitivity Level

4

Number of DMA Channels

64.0

Number of External Interrupts

4.0

Number of Terminals

548

Number of Timers

3.0

Operating Temperature-Min

-40.0  Cel

Operating Temperature-Max

105.0  Cel

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA548,26X26,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (Cel)

220

Power Supplies

1.4,3.3

Qualification Status

Not Qualified

RAM (words)

16384

Seated Height-Max

2.8  mm

Sub Category

Digital Signal Processors

Supply Voltage-Nom

1.4  V

Supply Voltage-Min

1.36  V

Supply Voltage-Max

1.44  V

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

BALL

Terminal Pitch

0.8  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

23.0  mm

Width

23.0  mm

Additional Feature

ALSO REQUIRES 3.3V SUPPLY


Features

·High-Performance Digital Media Processor (TMS320DM642)

-2-, 1.67-, 1.39-ns Instruction Cycle Time

-500-, 600-, 720-MHz Clock Rate

-Eight 32-Bit Instructions/Cycle

-4000, 4800, 5760 MIPS

-Fully Software-Compatible With C64x™

·VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word VLIW) TMS320C64x™ DSP Core

-Eight Highly Independent Functional Units With VelociTI.2™ Extensions:

--Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle

--Two Multipliers Support Four 16 x 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 x 8-Bit Multiplies (16-Bit Results) per Clock Cycle

-Load-Store Architecture With Non-Aligned Support

-64 32-Bit General-Purpose Registers

-Instruction Packing Reduces Code Size

-All Instructions Conditional

·Instruction Set Features

-Byte-Addressable (8-/16-/32-/64-Bit Data)

-8-Bit Overflow Protection

-Bit-Field Extract, Set, Clear

-Normalization, Saturation, Bit-Counting

-VelociTI.2™ Increased Orthogonality

·L1/L2 Memory Architecture

-128K-Bit (16K-Byte) L1P Program Cache (Direct Mapped)

-128K-Bit (16K-Byte) L1D Data Cache (2-Way Set-Associative)

-2M-Bit (256K-Byte) L2 Unified Mapped RAM/Cache (Flexible RAM/Cache Allocation)

·Endianess: Little Endian, Big Endian

·64-Bit External Memory Interface (EMIF)

-Glueless Interface to Asynchronous Memories (SRAM and EPROM) and Synchronous Memories (SDRAM, SBSRAM, ZBT SRAM, and FIFO)

-1024M-Byte Total Addressable External Memory Space

·Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)

·10/100 Mb/s Ethernet MAC (EMAC)

-IEEE 802.3 Compliant

-Media Independent Interface (MII)

-8 Independent Transmit (TX) Channels and 1 Receive (RX) Channel

·Management Data Input/Output (MDIO)

·Three Configurable Video Ports

-Providing a Glueless I/F to Common Video Decoder and Encoder Devices

-Supports Multiple Resolutions and Video Standards

·VCXO Interpolated Control Port (VIC)

-Supports Audio/Video Synchronization

·Host-Port Interface (HPI) [32-/16-Bit]

·32-Bit/66-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface Conforms to PCI Specification 2.2

·Multichannel Audio Serial Port (McASP)

-Eight Serial Data Pins

-Wide Variety of I2S and Similar Bit Stream Format

-Integrated Digital Audio I/F Transmitter Supports S/PDIF, IEC60958-1, AES-3, CP-430 Formats

·Inter-Integrated Circuit (I2C) Bus™

·Two Multichannel Buffered Serial Ports

·Three 32-Bit General-Purpose Timers

·Sixteen General-Purpose I/O (GPIO) Pins

·Flexible PLL Clock Generator

·IEEE-1149.1 (JTAG) Boundary-Scan-Compatible

·548-Pin Ball Grid Array (BGA) Package (GDK and ZDK Suffixes), 0.8-mm Ball Pitch

·548-Pin Ball Grid Array (BGA) Package (GNZ and ZNZ Suffixes), 1.0-mm Ball Pitch

·0.13-µm/6-Level Cu Metal Process (CMOS)

·3.3-V I/O, 1.2-V Internal (-500)

·3.3-V I/O, 1.4-V Internal (A-500, A-600, -600, -720)


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.A.2

HTSN

8542310001

SCHEDULE B

8542310000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant


Documents & Media

Datasheets

TMS320DM642 Datasheet

Design Resources

Development Tool Selector

EDA / CAD Models 

Download from Ultra Librarian

Online Catalog

DaVinci™


Product Manufacturer

Texas Instruments Inc. (TI) is an American technology company that designs and manufactures semiconductors and various integrated circuits, which it sells to electronics designers and manufacturers globally. Its headquarters are in Dallas, Texas, United States. TI is one of the top ten semiconductor companies worldwide, based on sales volume. Texas Instruments's focus is on developing analog chips and embedded processors, which accounts for more than 80% of their revenue. TI also produces TI digital light processing (DLP) technology and education technology products including calculators, microcontrollers and multi-core processors. To date, TI has more than 43,000 patents worldwide.


Product Range

Devices

Boards

Developer Tools

ARM ® PROCESSORS

AUTOMOTIVE PRODUCTS

IDENTIFICATION & SECURITY

Kinetis Cortex®-M Microcontrollers

In-Vehicle Network

NFC

LPC Cortex-M Microcontrollers

Microcontrollers and Processors

RFID


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Texas Instruments

IC FIXED-POINT DSP 548-FCBGA

Digi-Key

15 PCS

Texas Instruments

IC FIXED-POINT DSP 548-FCBGA

Avnet

Non-stock

Texas Instruments

DSP Fixed-Point 32-Bit 500MHz 4000MIPS 548-Pin FCBGA

Mouser

Non-stock

Texas Instruments

Digital Signal Processors & Controllers - DSP, DSC Video/Imaging Fixed-Point DSP


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

TMS320DM642AGDKA5 Popularity by Region 

TMS320DM642AGDKA5 Popularity by Region


Market Price Analysis

TMS320DM642AGDKA5 Market Price Analysis 

TMS320DM642AGDKA5 Market Price Analysis


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