Product Overview
Kynix Part #: | KY32-K4N56163QF-GC30 |
Manufacturer Part#: | K4N56163QF-GC30 |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | SAMSUNG |
Click Purchase button to buy original genuine K4N56163QF-GC30 | |
Description: | - |
Datasheet: | K4N56163QF-GC30 Datasheet |
Package: | BGA |
Quantity: | 2200 PCS |
K4N56163QF-GC30 Images are for reference only.
CAD Models
There is no relevant information available for this part yet.
Product Attributes
Categories | Integrated Circuits (ICs) Memory ICs |
Status | Obsolete |
Package Description | TFBGA |
Brand | SAMSUNG |
Sub Category | DRAMs |
Access Time-Max | 0.45 ns |
Access Mode | FOUR BANK PAGE BURST |
I/O Type | COMMON |
JESD-30 Code | R-PBGA-B84 |
JESD-609 Code | e0 |
Memory Density | 268435456 bit |
Memory IC Type | DDR DRAM |
Memory Width | 16 |
Moisture Sensitivity Level | 3 |
Number of Terminals | 84 |
Number of Words | 16777216 words |
Number of Words Code | 16000000 |
Number of Functions | 1 |
Number of Ports | 1 |
Organization | 16MX16 |
Operating Mode | SYNCHRONOUS |
Operating Temperature | 0°C~65°C |
Output Characteristics | 3-STATE |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA |
Package Equivalence Code | - |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | 240 |
Power Supplies | - |
Qualification Status | Not Qualified |
Risk Rank | 5.55 |
Rohs Code | No |
Seated Height-Max | 1.2 mm |
Supply Voltage-Nom (Vsup) | 1.8 V |
Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Max (Vsup) | 1.9 V |
Surface Mount | Yes |
Technology | CMOS |
Type | NAND TYPE |
Terminal Finish | TIN LEAD |
Terminal Form | BALL |
Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 30 |
Length | 13 mm |
Width | 11 mm |
Features
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Advantages and Disadvantages
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Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | EAR99 |
HTSN | 8542.32.00.24 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Documents & Media
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Product Manufacturer
Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.
Product Range
Dynamic random Access Memory | Solid State Disk | Embedded Memory |
Multiple Layer Packaging Chip | Processor | Image Sensor |
Device Security Solutions | Display Integrated Circuit | Power Integrated Circuit |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix | 2200 PCS | Samsung Semiconductor | - |
Sierra IC | 157 PCS | Samsung Semiconductor | - |
Vyrian | 731 PCS | Samsung Semiconductor | - |
New Strength Electronic | 32 PCS | Samsung Semiconductor | DC:1449+ ; BGA |
Alternative Models
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Popularity by Region
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Market Price Analysis
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