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K4N56163QF-GC30 Datasheets| SAMSUNG| PDF| Price| In Stock

Author: Apogeeweb
Date: 9 Dec 2019
 1173
IC Chips

Product Overview

Kynix Part #:

KY32-K4N56163QF-GC30

Manufacturer Part#:

K4N56163QF-GC30

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

SAMSUNG

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Purchase 

Description:

-

Datasheet:

K4N56163QF-GC30 Datasheet

Package:

BGA

Quantity:

2200 PCS


K4N56163QF-GC30 Images are for reference only.

K4N56163QF-GC30 Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Status

Obsolete

Package Description

TFBGA

Brand

SAMSUNG

Sub Category

DRAMs

Access Time-Max

0.45 ns

Access Mode

FOUR BANK PAGE BURST

I/O Type

COMMON

JESD-30 Code

R-PBGA-B84

JESD-609 Code

e0

Memory Density

268435456 bit

Memory IC Type

DDR DRAM

Memory Width

16

Moisture Sensitivity Level

3

Number of Terminals

84

Number of Words

16777216 words

Number of Words Code

16000000

Number of Functions

1

Number of Ports

1

Organization

16MX16

Operating Mode

SYNCHRONOUS

Operating Temperature

0°C~65°C

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

-

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

240

Power Supplies

-

Qualification Status

Not Qualified

Risk Rank

5.55

Rohs Code

No

Seated Height-Max

1.2 mm

Supply Voltage-Nom (Vsup)

1.8 V

Supply Voltage-Min (Vsup)

1.7 V

Supply Voltage-Max (Vsup)

1.9 V

Surface Mount

Yes

Technology

CMOS

Type

NAND TYPE

Terminal Finish

TIN LEAD

Terminal Form

BALL

Terminal Pitch

0.8 mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Length

13 mm

Width

11 mm


Features

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.32.00.24


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

2200 PCS

Samsung Semiconductor

-

Sierra IC

157 PCS

Samsung Semiconductor

-

Vyrian

731 PCS

Samsung Semiconductor

-

New Strength Electronic

32 PCS

Samsung Semiconductor

DC:1449+ ; BGA


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

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Market Price Analysis

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