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Apr 12 2019

XC7K325T-1FB900I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7K325T-1FB900I

Manufacturer Part#:

XC7K325T-1FB900I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 500 I/O 900FCBGA

Datasheet:

XC7K325T-1FB900I Datasheet

Package:

BGA

Quantity:

88 PCS


XC7K325T-1FB900I Images are for reference only.

XC7K325T-1FB900I


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Manufacturer:

Xilinx Inc.

Product Category:

IC Chips

Series:

Kintex-7

Package-Case:

900-BBGA, FCBGA

Operating-Temperature:

-40°C ~ 100°C (TJ)

Mounting-Type:

Surface Mount

Voltage-Supply:

0.97 V ~ 1.03 V

Supplier-Device-Package:

900-FCBGA (31x31)

Number-of-Gates:

--

Number-of-I-O:

500

Number-of-LABs-CLBs:

25475

Number-of-Logic-Elements-Cells:

326080

Total-RAM-Bits:

16404480

Audio I/O:

No

Configuration Memory:

16MB QSPI; 128MB BPI FLASH

Device Logic Cells:

326,080

Device Logic Units:

203,800

Display Mode:

HMDI Output

Ethernet:

Yes

GPIO:

Yes

Interface Standards:

FMC LPC; I2C; HPC; XADC; SMA; SFP+

Lead Finish:

Tin|Lead

Maximum Number of User I/Os:

350

Maximum Propagation Delay Time:

0.12 ns

Memory Card Interface:

SD Card

Memory Size:

1GB

Memory Type:

DDR3

Mounting:

Surface Mount

Number of Registers:

407,600

PCIe:

PCIe

Pin Count:

900

Product Dimensions:

31 x 31 x 2.65

RAM Bits:

16,404,480 Bit

Re-programmability Support:

1

Screening Level:

Industrial

Speed Grade:

1

Typical Operating Supply Voltage:

1.0000 V

USB:

USB-Serial Bridge

Part Life Cycle Code:

Active

ECCN Code:

3A991.D

HTS Code:

8542.39.00.01

Risk Rank:

5.66

Combinatorial Delay of a CLB-Max:

0.74 ns

JESD-30 Code:

JESD-609 Code:

Length:

31 mm

Number of CLBs:

25475

Seated Height-Max:

2.54 mm

Width:

31 mm


Product Features

• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

• High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

• High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

• Quickly deploy embedded processing with MicroBlaze™ processor.

• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Product Functions

Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN:

3A991D

HTSN:

8542390001"8542.39.00.01

SCHEDULE B:

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

 

Datasheets

Kintex-7 FPGAs Datasheet

Kintex-7 FPGAs CES9937 Errata

Kintex-7 FPGA CES Errata

7 Series FPGA Overview

 

PCN Assembly/Origin

Zynq-7000 Datasheet Update 02/Jun/2014

Cross-Ship Lead-Free Notice 31/Oct/2016

Product Marking Chg 31/Oct/2016

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014

PCN Packaging

Mult Devices 26/Jun/2017


Additional Resources

Standard Package

1


Product Manufacturer

Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known for inventing the field-programmable gate array (FPGA) and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

88 PCS

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Digikey

--

Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

Digipart

--

Xilinx Inc.

IC FPGA KINTEX-7 900-FBGA


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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