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Dec 6 2019

K4H561638F-TCB3 Datasheets| SAMSUNG| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-K4H561638F-TCB3

Manufacturer Part#:

K4H561638F-TCB3

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

SAMSUNG

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Description:

-

Datasheet:

K4H561638F-TCB3 Datasheet

Package:

TSOP

Quantity:

2200 PCS


K4H561638F-TCB3 Images are for reference only.

K4H561638F-TCB3 Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Memory ICs

Package Description

0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66

REACH Compliant

Yes

Status

Obsolete

Access Mode

FOUR BANK PAGE BURST

Address Bus Width

15 b

Access Time-Max

0.7 ns

Clock Frequency-Max (fCLK)

166 MHz

I/O Type

COMMON

Interleaved Burst Length

2, 4,8

JESD-30 Code

R-PDSO-G66

JESD-609 Code

e0

Memory Density

268435456 bit

Memory IC Type

DDR DRAM

Max Frequency

333 MHz

Memory Width

16

Number of Terminals

66

Number of Words

16777216 words

Number of Words Code

16000000

Number of Functions

1

Number of Ports

1

Organization

16MX16

Output Characteristics

3-STATE

Operating Temperature

0°C~70°C

Package Body Material

PLASTIC/EPOXY

Package Code

TSOP2

Package Equivalence Code

TSSOP66,.46

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE

Pin Count

60

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Qualification Status

Not Qualified

Risk Rank

5.24

Refresh Cycles

8192

Rohs Code

No

Sub Category

DRAMs

Sequential Burst Length

2, 4, 8

Seated Height-Max

1.2 mm

Supply Current-Max

0.35 Amp

Supply Voltage-Nom (Vsup)

2.5 V

Supply Voltage-Min (Vsup)

2.3 V

Supply Voltage-Max (Vsup)

2.7 V

Surface Mount

Yes

Technology

CMOS

Temperature Grade

COMMERCIAL

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Form

GULL WING

Terminal Pitch

0.65 mm

Terminal Position

DUAL

Length

22.22 mm

Width

10.16 mm

Additional Feature

AUTO/SELF REFRESH


Features

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.32.00.24


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Samsung Semiconductor is a South Korean multinational electronics company headquartered in Suwon, South Korea. Due to some circular ownership, it is the flagship company of the Samsung chaebol. Samsung was founded by Lee Byung-chul in 1938 as a trading company. Discover the innovative semiconductor solutions including DRAM, SSD, processor, image sensor and other products for diverse industries to prepare mega trends with Samsung.


Product Range

Dynamic random Access Memory

Solid State Disk

Embedded Memory

Multiple Layer Packaging Chip

Processor

Image Sensor

Device Security Solutions

Display Integrated Circuit

Power Integrated Circuit


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

2200 PCS

Samsung Semiconductor

-

Quest Components

23 PCS

Samsung Semiconductor

SDRAM, DDR, 16M x 16, 66 Pin, Plastic, TSSOP

Chip 1 Exchange

162 PCS

-

-

Bristol Electronics

63 PCS

Samsung Semiconductor

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 K4H561638F-TCB3 Popularity by Region

K4H561638F-TCB3 Popularity by Region

Market Price Analysis

K4H561638F-TCB3 Market Price Analysis 

K4H561638F-TCB3 Market Price Analysis


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