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Dec 2 2019

MK40DX256ZVLQ10 Datasheets| NXP| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-MK40DX256ZVLQ10

Manufacturer Part#:

MK40DX256ZVLQ10

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Freescale Semiconductor - NXP

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Description:

IC MCU 32BIT 256KB FLASH 144LQFP

Datasheet:

MK40DX256ZVLQ10 Datasheet

Package:

144-LQFP

Quantity:

586 PCS


MK40DX256ZVLQ10 Images are for reference only.

MK40DX256ZVLQ10 Image 


CAD Models

MK40DX256ZVLQ10 Footprint 

MK40DX256ZVLQ10 Footprint


Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - Microcontrollers

Series

Kinetis K40

Brand

NXP

Status

Not For New Designs

EU RoHS Compliant

Yes

Package Description

20 X 20 MM, LQFP-144

Analog Comparators

3

ADC Channels

Yes

Address Bus Width

0.0

Base Part Number

MK40DX256

Bit Size

32

Core Processor

ARM® Cortex®-M4

CECC Qualified

No

CPU Family

CORTEX-M4

CPU Speed

100 MHz

Core Size

32-Bit

Core Architecture

ARM

Connectivity

CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG

Peripherals

DMA, I²S, LCD, LVD, POR, PWM, WDT

Clock Frequency-Max

32.0 MHz

Device Core

ARM Cortex M4

DAC Channels

Yes

DMA Channels

Yes

Data Bus Width

32 bit

Data Converters

A/D 42x16b; D/A 2x12b

Data RAM Size

4 kB

Ethernet

0

External Data Bus Width

0.0

EEPROM Size

4K x 8

Family Name

K40

Instruction Set Architecture

RISC

JESD-30 Code

S-PQFP-G144

JESD-609 Code

e3

LCD Segments

48

Moisture Sensitive  

Yes

MCU Family

Kinetis K

MCU Series

K4x

MCU Applications

USB and Segment LCD Controller

MCU Case Style

LQFP

Maximum Clock Rate

100 MHz

Mounting  

Surface Mount

Maximum Clock Frequency

100 MHz

MSL Level

3

Moisture Sensitive

Yes

Number of I/Os

100

Number of Terminals

144

Number of PWM Channels

1

Number of USART Channels

0

Number of UART Channels

0

Number of CAN Channels

2

Number of I2C Channels

2

Number of I2S Channels

1

Number of SPI Channels

3

Number of ADCs

Dual

Number of DACs

Dual

Number of Timers

14

Oscillator Type

Internal

Operating Supply Voltage

1.8, 2.5, 3.3 V

Operating Temperature

-40°C ~ 105°C (TA)

Pin Count

144

Packaging

Tray

Product Dimensions

20 x 20 x 1.45 mm

Product Type

ARM Microcontrollers - MCU

Processor Series

K40

Program Memory Size

256KB (256K x 8)

Program Memory Type

FLASH

Package Body Material

PLASTIC/EPOXY

Package Code

LFQFP

Package Equivalence Code

QFP144,.87SQ,20

Package Shape

SQUARE

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Programmability

Yes

Peak Reflow Temperature (Cel)

260

Package / Case

144-LQFP

Supplier Device Package

144-LQFP (20x20)

Product Category

ARM Microcontrollers - MCU

Power Supplies

1.8/3.3 V

Qualification

Not Qualified

Risk Rank

7.9

RAM (bytes)

65,536

ROM Programmability

FLASH

ROM (words)

262144

Rohs Code

Yes

REACH SVHC

No SVHC

Radiation Hardening

No

RAM Size

64K x 8

Speed

100 MHz

Subcategory

Microcontrollers - MCU

Special Features

CAN Controller,LCD Controller

Seated Height-Max

1.6 mm

Supply Voltage-Max

3.6 V

Supply Voltage-Min

1.71 V

Supply Voltage-Nom

3.3 V

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Finish

Matte Tin (Sn)

Terminal Position

QUAD

Time@Peak Reflow Temperature-Max (s)

40

Tradename

Kinetis

Voltage - Supply (Vcc/Vdd)

1.71V ~ 3.6V

Watchdog

1

Width

20 mm

Length

20 mm

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC


Features

Ultra-Low-Power

  • 10 low-power modes with power and clock gating for optimal peripheral activity and recovery times. Stop currents down to 2 µA, and run currents of <350 µA/MHz, with 4 µs wake-up from Stop mode

  • Full memory and analog operation down to 1.71 volts for extended battery life

  • Low-leakage wake-up unit with up to eight internal modules and 16 pins as wake-up sources in low-leakage stop (LLS)/very low-leakage stop (VLLS) modes

  • Low-power timer for continual system operation in reduced power state

Flash, SRAM and FlexMemory

  • 128 KB - 512 KB flash. Fast access, high reliability with four-level security protection

  • 32 KB-128 KB of SRAM

  • FlexMemory: 32 bytes-4KB of user-segmentable byte write/erase EEPROM for data tables/system data. EEPROM with over 10M cycles and flash with 70 µsec write time (brownouts without data loss/corruption). No user or system intervention to complete programming and erase functions and full operation down to 1.71 volts. In addition, upto 256 KB can be used for extra program code, data or EEPROM backup

Mixed-Signal Capability

  • Two high-speed 16-bit analog-to-digital converter (ADC) with configurable resolution. Single or differential output mode operation for improved noise rejection. 500 ns conversion time achievable with programmable delay block triggering

  • Up two 12-bit digital-to-analog converter (DAC) for analog waveform generation for audio applications

  • Three high-speed comparators providing fast and accurate motor over-current protection by driving PWMs to a safe state

  • Analog voltage reference provides an accurate reference to analog blocks, ADC and DAC, and replaces external voltage references to reduce system cost

Performance

  • Arm® Cortex®-M4 core with DSP, 100MHz clock, single cycle MAC, and single instruction multiple data (SIMD) extensions

  • 16-channel DMA for peripheral and memory servicing with reduced CPU loading and faster system throughput

  • Cross bar switch enables concurrent multi-master bus accesses, increasing bus bandwidth

  • Independent flash banks allow concurrent code execution and firmware updating with no performance degradation or complex coding routines

Timing and Control

  • Up to three FlexTimers with a total of 12 channels. Hardware dead-time insertion and quadrature decoding for motor control

  • Carrier modulator timer for infrared waveform generation in remote control applications

  • Four-channel 32-bit periodic interrupt timer provides time base for RTOS task scheduler or trigger source for ADC conversion and programmable delay block

Human-Machine Interface

  • Hardware touch-sensing interface with up to 16 inputs. Operates in all low power modes (minimum current adder when enabled). Hardware implementation avoids software polling method. High sensitivity level allows use of overlay surfaces upto 5 mm thick

  • Flexible, low-power LCD controller with up to 320 segments (40x8 or 44x4). LCD blink mode enables low average power while remaining in low-power mode. Segment fail detect guards against erroneous readouts and reduces LCD test costs. Frontplane/backplane reassignment provides pin-out flexibility easing PCB design and allows LCD configuration changes via firmware with no hardware re-work. Supports multiple 3 volts and 5 volts LCD panel sizes with fewer segments (pins) than competitive controllers and no external components. Unused LCD pins can be configured as other GPIO functions

Connectivity and Communications

  • USB 2.0 On-The-Go (full speed). Device charge detect optimizes charging current/time for portable USB devices enabling longer battery life. Low-voltage regulator supplies up to 120 mA off chip at 3.3V to power external components from 5V input

  • Up to six UARTs with IrDA support including one UART with ISO7816 smart card support. Variety of data size, format and transmission/reception settings supported for multiple industrial communication protocols

  • Inter-IC Sound (I2S) serial interface for audio system interfacing

  • Two CAN modules for industrial network bridging

  • Up to three DSPI and two I2C

Reliability, Safety and Security

  • Memory protection unit provides memory protection for all masters on the cross bar switch, increasing software reliability

  • Cyclic redundancy check engine validates memory contents and communication data, increasing system reliability

  • Independent-clocked COP guards against clock skew or code runaway for fail-safe applications such as the IEC 60730 safety standard for household appliances

  • External watchdog monitor drives output pin to safe state external components if watchdog event occurs

  • This product is included in NXP®.s product longevity program, with assured supply for a minimum of 10 years after launch

External Peripheral Support

  • FlexBus external bus interface provides interface options to memories and peripherals such as graphics displays. Supports up to 6 chip selects and 2GB addressable space

  • Secure digital host controller supports SD, SDIO, MMC or CE-ATA cards for in-application software upgrades, or media files.


Advantages and Disadvantages

Advantages

The Kinetis® K40 100 MHz MCU family provides advanced analog integration and serial communication for consumer, industrial, and medical applications.

  • Offers industry-leading low power and mixed signal analog integration

  • Includes a rich suite of analog, communication, timing and control peripherals to accommodate a wide range of requirements

  • Optimizes charging current/time for portable USB devices, enabling longer battery life

  • Shares the comprehensive enablement and scalability of the Kinetis portfolio


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.A.2

HTSN

8542.31.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

K40_ZLQ/ZMD10 Datasheet

K40 Family Fact Sheet

K40_ZLQ/ZMD10 Ref Manual

Environmental Information

NXP RoHS3 Cert

PCN Design/Specification

KINETIS K, L, COLDFIRE+ Errata Update 17/Oct/2013


Product Manufacturer

NXP Semiconductors N.V. is a Dutch global semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $6.1 billion in 2015, including one month of revenue contribution from recently merged Freescale Semiconductor.

On October 27, 2016, it was announced that Qualcomm would try to buy NXP, but because the Chinese merger authority did not approve the acquisition before the deadline set by Qualcomm, it was effectively canceled on 26 July 2018.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

586 PCS

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

Digi-Key

Limited Supply

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

Avnet

Americas - 0

Avnet, Inc.

MCU 32-bit K40 ARM Cortex M4 RISC 256KB Flash 1.8V/2.5V/3.3V 144-Pin LQFP Tray - Trays (Alt: MK40DX256ZVLQ10)

Mouser

Non-Stock

NXP

ARM Microcontrollers - MCU KINETIS 256KFLEX USBSLCD


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

MK40DX256ZVLQ10 Popularity by Region 

MK40DX256ZVLQ10 Popularity by Region


Market Price Analysis

 MK40DX256ZVLQ10 Market Price Analysis

MK40DX256ZVLQ10 Market Price Analysis


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