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Mar 13 2019

PC28F256P30B85 Datasheets| INTEL| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-PC28F256P30B85

Manufacturer Part#:

PC28F256P30B85

Product Category:

Memory

Stock:

Yes

Manufacturer:

INTEL

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Description:

IC FLASH 256M PARALLEL 64EASYBGA

Detailed Description

FLASH - NOR Memory IC 256Mb (16M x 16) Parallel 52MHz 85ns 64-EasyBGA (10x13)

Datasheet:

PC28F256P30B85 Datasheet

Package:

64-TBGA

Quantity:

1765 PCS


PC28F256P30B85 Images are for reference only.

PC28F256P30B85


CAD Models

footprint

Footprint


Product Attributes

Categories:

Integrated Circuits (ICs)

Memory

Manufacturer:

Micron Technology Inc.

Series:

StrataFlash™

Packaging :

Tray

Part Status:

Obsolete

Memory Type:

Non-Volatile

Memory Format:

FLASH

Technology:

FLASH - NOR

Memory Size:

256Mb (16M x 16)

Clock Frequency:

52MHz

Write Cycle Time - Word, Page:

85ns

Access Time:

85ns

Memory Interface:

Parallel

Voltage - Supply:

1.7V ~ 2V

Operating Temperature:

-40°C ~ 85°C (TA)

Mounting Type:

Surface Mount

Package / Case:

64-TBGA

Supplier Device Package:

64-EasyBGA (10x13)

Base Part Numbe:

28F256P30

Standard Package:

144

Additional Feature

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

REACH Compliant

Yes

EU RoHS Compliant

Yes

Boot Block

BOTTOM

Command User Interface

YES

Common Flash Interface

YES

Data Polling

NO

JESD-30 Code

R-PBGA-B64

JESD-609 Code

e1

Memory Density

2.68435456E8  bit

Memory Width

16

Number of Functions

1

Number of Sectors/Size

4,255

Number of Terminals

64

Number of Words

1.6777216E7  words

Number of Words Code

16M

Operating Mode

ASYNCHRONOUS

Organization

16MX16

Package Body Material

PLASTIC/EPOXY

Package Code

TBGA

Package Equivalence Code

BGA64,8X8,40

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE

Page Size (words)

4

Parallel/Serial

PARALLEL

Peak Reflow Temperature (Cel)

260

Seated Height-Max

1.2  mm

Sector Size (Words)

16K,64K

Standby Current-Max

5.0E-6  Amp

Supply Current-Max

0.051  Amp

Surface Mount

YES

Technology

CMOS

Temperature Grade

INDUSTRIAL

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

1.0  mm

Length

13.0  mm

Width

10.0  mm


Features

 High performance

— 85 ns initial access

— 52 MHz with zero wait states, 17ns clock-to-data output synchronous-burst read mode

— 25 ns asynchronous-page read mode

— 4-, 8-, 16-, and continuous-word burst mode

— Buffered Enhanced Factory Programming (BEFP) at 5 μs/ byte (Typ)

— 1.8 V buffered programming at 7 μs/byte (Typ)

 Architecture

— Multi-Level Cell Technology: Highest Density at Lowest Cost

— Asymmetrically-blocked architecture

— Four 32-KByte parameter blocks: top or bottom configuration

— 128-KByte main blocks

 Voltage and Power

— VCC (core) voltage: 1.7 V – 2.0 V

— VCCQ (I/O) voltage: 1.7 V – 3.6 V

— Standby current: 20μA (Typ) for 64-Mbit

— 4-Word synchronous read current: 13 mA (Typ) at 40 MHz

 Quality and Reliability

— Operating temperature: –40 °C to +85 °C

— Minimum 100,000 erase cycles per block

— ETOX™ VIII process technology

•Security

— One-Time Programmable Registers: • 64 unique factory device identifier bits • 2112 user-programmable OTP bits

— Selectable OTP Space in Main Array: • Four pre-defined 128-KByte blocks (top or bottom configuration) • Up to Full Array OTP Lockout

— Absolute write protection: VPP = VSS

— Power-transition erase/program lockout

— Individual zero-latency block locking

— Individual block lock-down

 Software

— 20 μs (Typ) program suspend

— 20 μs (Typ) erase suspend

— Numonyx™ Flash Data Integrator optimized

— Basic Command Set and Extended Command Set compatible

— Common Flash Interface capable

 Density and Packaging

— 56- Lead TSOP package (64, 128, 256, 512- Mbit)

— 64- Ball Numonyx™ Easy BGA package (64, 128, 256, 512- Mbit)

— Numonyx™ QUAD+ SCSP (64, 128, 256, 512- Mbit)

— 16-bit wide data bus


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


ECCN / UNSPSC

There is no relevant information available for this part yet.


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

P30 StrataFlash Embedded Memory

PCN Packaging

Standard Pkg Label Chg 20/Feb/2019

PCN Obsolescence/ EOL

EOL 05/Dec/2016


Product Manufacturer

Intel Corporation (commonly known as Intel and stylized as intel) is an American multinational corporation and technology company headquartered in Santa Clara, California, in the Silicon Valley. It is the world's second largest and second highest valued semiconductor chip manufacturer based on revenue after being overtaken by Samsung, and is the inventor of the x86 series of microprocessors, the processors found in most personal computers (PCs). Intel ranked No. 46 in the 2018 Fortune 500 list of the largest United States corporations by total revenue.

Intel supplies processors for computer system manufacturers such as Apple, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing.

Intel Corporation (commonly known as Intel and stylized as intel) is an American multinational corporation and technology company headquartered in Santa Clara, California, in the Silicon Valley. It is the world's second largest and second highest valued semiconductor chip manufacturer based on revenue after being overtaken by Samsung, and is the inventor of the x86 series of microprocessors, the processors found in most personal computers (PCs). Intel ranked No. 46 in the 2018 Fortune 500 list of the largest United States corporations by total revenue.

Intel supplies processors for computer system manufacturers such as Apple, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing.


Product Range

shift register

random-access

Pentium

x86 processors

386 microprocessor

Mobile Linux software

IBM PC

Itanium

Remote Keyboard Android App


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

1765 PCS

INTEL

IC FLASH 256M PARALLEL 64EASYBGA

Digikey

--

Micron Technology Inc.

IC FLASH 256M PARALLEL 64EASYBGA

Octopart

--

INTEL

NOR Flash 256M-bit 16M x 16 85ns 64-Pin EZBGA 


Product Functions

This document provides information about the Numonyx™ StrataFlash® Embedded Memory (P30) product and describes its features, operation, and specifications. The Numonyx™ StrataFlash® Embedded Memory (P30) product is the latest generation of Numonyx™ StrataFlash® memory devices. Offered in 64-Mbit up through 512-Mbit densities, the P30 device brings reliable, two-bit-per-cell storage technology to the embedded flash market segment. Benefits include more density in less space, highspeed interface, lowest cost-per-bit NOR device, and support for code and data storage. Features include high-performance synchronous-burst read mode, fast asynchronous access times, low power, flexible security options, and three industry standard package choices. The P30 product family is manufactured using Intel* 130 nm ETOX™ VIII process technology. The P30 product family is also planned on the Intel* 65nm process lithography. 65nm AC timing changes are noted in this datasheet, and should be taken into account for all new designs.


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

Popularity by Region


Market Price Analysis

Market Price Analysis


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