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Mar 11 2019

XC7VX330T-3FFG1157E Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7VX330T-3FFG1157E

Manufacturer Part#:

XC7VX330T-3FFG1157E

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 600 I/O 1157FCBGA

Datasheet:

XC7VX330T-3FFG1157E Datasheet

Package:

BGA

Quantity:

88 PCS


XC7VX330T-3FFG1157E Images are for reference only.

XC7VX330T-3FFG1157E


CAD Models

Symbol

Symbol

Footprint

Footprint


Product Attributes

Manufacturer:

Xilinx Inc.

Product Category:

IC Chips

Series:

VirtexR-7

Package-Case:

1156-BBGA, FCBGA

Operating-Temperature:

0°C ~ 100°C (TJ)

Mounting-Type:

Surface Mount

Voltage-Supply:

0.97 V ~ 1.03 V

Supplier-Device-Package:

1157-FCBGA (35x35)

Number-of-Gates:

--

Number-of-I-O:

600

Number-of-LABs-CLBs:

25500

Number-of-Logic-Elements-Cells:

326400

Total-RAM-Bits:

27648000

Part Status:

Active

Lead Finish:

Tin|Silver|Copper

Max Processing Temp:

245

Maximum Propagation Delay Time:

0.09 ns

MSL Level:

4

Number of Registers:

408,000

Pin Count:

1157

Product Dimensions:

35 x 35 x 2.75(Max)

RAM Bits:

27,648,000 Bit

Re-programmability Support:

Yes

Screening Level:

Extended

Speed Grade:

3

Supplier Package:

FCBGA

Length:

35.0  mm

Width:

35.0  mm

Time@Peak Reflow Temperature-Max (s):

NOT SPECIFIED

Technology:

CMOS


Features

• Advanced high-performance FPGA logic based on real 6-input look-up table (LUT) technology configurable as distributed memory.

• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

• High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

• High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

• Quickly deploy embedded processing with MicroBlaze™ processor.

• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flip-chip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:

• Spartan®-7 Family: Optimized for low cost, lowest power, and high I/O performance. Available in low-cost, very small form-factor packaging for smallest PCB footprint.

• Artix®-7 Family: Optimized for low power applications requiring serial transceivers and high DSP and logic throughput. Provides the lowest total bill of materials cost for high-throughput, cost-sensitive applications.

• Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

• Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


ECCN/ UNSPSC

Description:

Value:

ECCN:

3A991D

HTSN:

8542390001"8542.39.00.01

SCHEDULE B:

8542390000"8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3(168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

Virtex-7 T/XT FPGA Datasheet

Virtex-7 FPGAs Brief

7 Series FPGA Overview

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

 

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014


Product Manufacturer

Xilinx, Inc. is an American technology company, primarily a supplier of programmable logic devices. It is known for inventing the field-programmable gate array (FPGA) and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

88 PCS

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Digikey

--

Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

Avnet

Min: 1 Mult: 1

Xilinx Inc.

FPGA Virtex-7 XT Family 326400 Cells 28nm Technology 1V 1157-Pin FC-BGA


Product Functions

Virtex®-7 T and XT FPGAs are available in -3, -2, -1, and -2L speed grades, with -3 having the highest performance. The -2L devices operate at VCCINT = 1.0V and are screened for lower maximum static power. The speed specification of a -2L device is the same as the -2 speed grade. The -2G speed grade is available in devices utilizing Stacked Silicon Interconnect (SSI) technology. The -2G speed grade supports 12.5 Gb/s GTX or 13.1 Gb/s GTH transceivers as well as the standard -2 speed grade specifications. Virtex-7 T and XT FPGA DC and AC characteristics are

specified in commercial, extended, industrial, and military temperature ranges. Except for the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1M speed grade military device are the same as for a -1C speed grade commercial device). However, only selected speed grades and/or

devices are available in each temperature range.


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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