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Nov 7 2019

MCF5471ZP200 Datasheets|Freescale Semiconductor, Inc. | PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-MCF5471ZP200

Manufacturer Part#:

MCF5471ZP200

Product Category:

Embedded - Microcontrollers

Stock:

Yes

Manufacturer:

Freescale Semiconductor, Inc.

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Description:

IC MCU 32BIT 388PBGA

Datasheet:

MCF5471ZP200 Datasheet

Package:

388-BBGA

Quantity:

2331 PCS


MCF5471ZP200 Images are for reference only.

MCF5471ZP200 Image 


CAD Models

 MCF5471ZP200 Footprint

MCF5471ZP200 Footprint


Product Attributes

Categories

Integrated Circuits (ICs) Embedded - Microcontrollers

Manufacturer

NXP USA Inc.

Series

MCF547x

Packaging

Tray

Part Status

Not For New Designs

Core Processor

Coldfire V4E

Core Size

32-Bit

Speed

200MHz

Connectivity

EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB

Peripherals

DMA, PWM, WDT

Number of I/O

99

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

32K x 8

Data Converters

-

Oscillator Type

External

Package / Case

388-BBGA

Supplier Device Package

388-PBGA (27x27)

Base Part Number

MCF5471

Mfr Package Description

27 X 27 MM, MS-034AAL-1, PBGA-388

Status

Transferred

Address Bus Width

32.0

Bit Size

32

Boundary Scan

YES

Clock Frequency-Max

66.66  MHz

External Data Bus Width

32.0

Format

FLOATING POINT

Integrated Cache

YES

JESD-30 Code

S-PBGA-B388

JESD-609 Code

e0

Low Power Mode

YES

Moisture Sensitivity Level

3

Number of Terminals

388

Operating Temperature-Min

0.0  Cel

Operating Temperature-Max

70.0  Cel

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA388,26X26,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

260

Power Supplies

1.5,2.5,3.3

Qualification Status

Not Qualified

Seated Height-Max

2.55  mm

Speed

200.0  MHz

Sub Category

Microprocessors

Supply Voltage-Nom

1.5  V

Supply Voltage-Min

1.43  V

Supply Voltage-Max

1.58  V

Surface Mount

YES

Technology

CMOS

Temperature Grade

COMMERCIAL

Terminal Finish

Tin/Lead/Silver (Sn/Pb/Ag)

Terminal Form

BALL

Terminal Pitch

1.0  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

40

Length

27.0  mm

Width

27.0  mm

 


Features

·  ColdFire V4 core-delivering up to 410 (Dhrystone 2.1) MIPS @ 266 MHz

·  Memory management unit (MMU)

·  Dual precision floating point unit (FPU)

·  Enhaced multiply-accumulate (MAC) module handles DSP-like instructions

·  32 KB I-Cache, 32 KB D-Cache

·  32 KB on-chip system SRAM

·  Integrated peripherals

- 10/100 fast Ethernet controller (FEC)

- UART/USART/IRDA/modem programmable serial controller

- 32-bit V2.2 PCI, 33/66 MHz, five external masters

- Direct memory access (DMA) serial pheripheral interface (SPI)

- I²C interface

- 16-channel direct memory access (DMA) controller

- 32-bit 133 MHz DDR/SDR-SDRAM controller

- 388 PBGA package

·  Security

- Optional hardware-accelerated encryption (DES, 3DES, RC4, AES, MD5, SHA-1, RNG)


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

5A002.A.1

HTSN

8542310001

SCHEDULE B

8542310000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant


Documents & Media

Datasheets

MCF547x Datasheet
MCF547x Ref Manual

Environmental Information

NXP RoHS3 Cert

Design Resources

Development Tool Selector

PCN Design/Specification

Copper Wire Update 23/Jun/2015


Product Manufacturer

NXP Semiconductors N.V.is a Dutch global Semiconductor manufacturer headquartered in Eindhoven, Netherlands. The company employs approximately 31,000 prople in more than 35 countries, including 11,200 engineers in 33 counties. NXP Semiconductors N.V. enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security, and privacy and smart connected solutions markets.


Product Range

Devices

Boards

Developer Tools

ARM ® PROCESSORS

AUTOMOTIVE PRODUCTS

IDENTIFICATION & SECURITY

Kinetis Cortex®-M Microcontrollers

In-Vehicle Network

NFC

LPC Cortex-M Microcontrollers

Microcontrollers and Processors

RFID


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

2331 PCS

Freescale Semiconductor, Inc.

IC MCU 32BIT 388PBGA

Digi-Key

Non-stock

NXP USA Inc.

IC MCU 32BIT ROMLESS 388BGA

Avnet

Non-stock

NXP

MPU MCF5xxx RISC 32-Bit 200MHz 2.5V/3.3V 388-Pin BGA Tray

Mouser

Non-stock

NXP Semiconductors

Microprocessors - MPU MCF547X V4ECORE MMU FPU


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

 MCF5471ZP200 Popularity by Region

MCF5471ZP200 Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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