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Nov 2 2019

MT41K256M8DA-15E:M Datasheets| Micron Technology Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-MT41K256M8DA-15E:M

Manufacturer Part#:

MT41K256M8DA-15E:M

Product Category:

Memory IC

Stock:

Yes

Manufacturer:

Micron Technology Inc.

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Description:

IC DDR3 SDRAM 2GBIT 667MHZ 78BGA

Datasheet:

MT41K256M8DA-15E:M Datasheet

Package:

FBGA

Quantity:

1223 PCS


MT41K256M8DA-15E:M Images are for reference only.

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CAD Models

MT41K256M8DA-15E:M Symbol 

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 MT41K256M8DA-15E:M Footprint

MT41K256M8DA-15E:M Footprint


Product Attributes

Categories

Memory IC

Manufacturer

Micron Technology Inc.

Series

-

Packaging

Tray

Part Status

Obsolete

Memory Type

Volatile

Memory Format

DRAM

Technology

SDRAM - DDR3L

Memory Size

2Gb (256M x 8)

Memory Interface

Parallel

Clock Frequency

667MHz

Write Cycle Time - Word, Page

-

Access Time

13.5ns

Operating Temperature

0°C ~ 95°C (TC)

Mounting Type

Surface Mount

Package / Case

78-TFBGA

Supplier Device Package

78-FBGA (8x10.5)

Base Part Number

MT41K256M8

Mfr Package Description

8 X 10.50 MM, LEAD FREE, FBGA-78

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Discontinued

Sub Category

DRAMs

Access Mode

MULTI BANK PAGE BURST

Access Time-Max

0.255  ns

Clock Frequency-Max (fCLK)

667.0  MHz

Interleaved Burst Length

8

I/O Type

COMMON

JESD-30 Code

R-PBGA-B78

JESD-609 Code

e3

Memory Density

2.147483648E9  bit

Memory IC Type

DDR DRAM

Moisture Sensitivity Level

1

Number of Functions

1

Number of Ports

1

Number of Terminals

78

Number of Words

2.68435456E8  words

Number of Words Code

256M

Operating Mode

SYNCHRONOUS

Organization

256MX8

Output Characteristics

3-STATE

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Equivalence Code

BGA78,9X13,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (Cel)

260

Qualification Status

Not Qualified

Refresh Cycles

8192.0

Seated Height-Max

1.2  mm

Sequential Burst Length

8

Standby Current-Max

0.012  Amp

Supply Current-Max

0.205  Amp

Supply Voltage-Nom (Vsup)

1.35  V

Supply Voltage-Min (Vsup)

1.283  V

Supply Voltage-Max (Vsup)

1.45  V

Surface Mount

YES

Technology

CMOS

Terminal Finish

MATTE TIN

Terminal Form

BALL

Terminal Pitch

0.8  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

30

Length

10.5  mm

Width

8.0  mm

Additional Feature

AUTO/SELF REFRESH

 


Features

• VDD = VDDQ = 1.35V (1.283–1.45V)

• Backward-compatible to VDD = VDDQ = 1.5V ±0.075V

• Differential bidirectional data strobe

• 8n-bit prefetch architecture

• Differential clock inputs (CK, CK#)

• 8 internal banks

• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

• Programmable CAS (READ) latency (CL)

• Programmable posted CAS additive latency (AL)

• Programmable CAS (WRITE) latency (CWL)

• Fixed burst length (BL) of 8 and burst chop (BC) of 4 (via the mode register set [MRS])

• Selectable BC4 or BL8 on-the-fly (OTF)

• Self refresh mode

• TC of 0°C to +95°C

– 64ms, 8192-cycle refresh at 0°C to +85°C

– 32ms at +85°C to +95°C

• Self refresh temperature (SRT)

• Automatic self refresh (ASR)

• Write leveling

• Multipurpose register

• Output driver calibration


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

EAR99

HTSN

8542.32.00.36


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / ROHS3 Compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Micron Technology, Inc. is an American global corporation based in Boise, Idaho. The company is a holding company for subsidiaries engaged in the design and production of computers, semiconductors, and other related products. The subsidiaries produce many forms of semiconductor devices, including dynamic random-access memory, flash memory, USB flash drives and solid-state drives. Its consumer products are marketed under the brands Crucial and Ballistix. Micron and Intel together created IM Flash Technologies, which produces NAND flash memory. It owned Lexar between 2006 and 2017.


Product Range

Memory

Storage

Advanced Solutions

DRAM

Memory Cards

3D XPointTechnology

DRAM Modules

Solid State Drives

Advanced Computing Solutions


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

1223 PCS

Micron Technology Inc.

IC DDR3 SDRAM 2GBIT 667MHZ 78BGA

Digi-Key

Non-stock

Micron Technology Inc.

-

Avnet

Non-stock

Micron Technology Inc.

-

Mouser

Non-stock

Micron Technology Inc.

DRAM


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

MT41K256M8DA-15E:M Popularity by Region 

MT41K256M8DA-15E:M Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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