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Nov 1 2019

XC7VX1140T-2FLG1928C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7VX1140T-2FLG1928C

Manufacturer Part#:

XC7VX1140T-2FLG1928C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 480 I/O 1928FCBGA

Datasheet:

XC7VX1140T-2FLG1928C Datasheet

Package:

BGA1928

Quantity:

141 PCS


XC7VX1140T-2FLG1928C Images are for reference only.

XC7VX1140T-2FLG1928C Image 


CAD Models

XC7VX1140T-2FLG1928C Symbol 

XC7VX1140T-2FLG1928C Symbol

 XC7VX1140T-2FLG1928C Footprint

XC7VX1140T-2FLG1928C Footprint


Product Attributes

Categories

Integrated Circuits (ICs)

Series

Virtex®-7 XT

Packaging

Tray

Part Status

Active

Number of LABs/CLBs

89000

Number of Logic Elements/Cells

1139200

Total RAM Bits

69304320

Number of I/O

480

Voltage - Supply

0.97V ~ 1.03V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

1924-BBGA, FCBGA

Supplier Device Package

1928-FCBGA (45x45)

Base Part Number

XC7VX1140T

Mfr Package Description

FBGA-1928

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

1818.0  MHz

Combinatorial Delay of a CLB-Max

0.61  ns

JESD-30 Code

S-PBGA-B1928

JESD-609 Code

e1

Number of Logic Cells

1139200.0

Number of Terminals

1928

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA1924,44X44,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

1,1.8

Qualification Status

Not Qualified

Seated Height-Max

3.75  mm

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.0  V

Surface Mount

YES

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form

BALL

Terminal Pitch

1.0  mm

Terminal Position

BOTTOM

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

45.0  mm

Width

45.0  mm


Features

Summary of 7 Series FPGA Features:

• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

• High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

• High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. Rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

• Quickly deploy embedded processing with MicroBlaze™ processor.

• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A001.A.7.B

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

7 Series FPGA Overview

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013


Product Manufacturer

Xilinx, Inc.is an American technology company and is primarily a supplier of programmable logic devices. It is known for inventing the field-programming gate array and as the semiconductor company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

 141 PCS

Xilinx, Inc.

IC FPGA 480 I/O 1928FCBGA

Digi-Key

Non-Stock

Xilinx, Inc.

IC FPGA 480 I/O 1928FCBGA

Avnet

Non-Stock

Xilinx, Inc.

-

Mouser

1 PCS

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC7VX1140T-2FLG1928C Popularity by Region 

XC7VX1140T-2FLG1928C Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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