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Feb 27 2019

CYD36S72V18-167BGXI Datasheets| Cypress Semiconductor| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-CYD36S72V18-167BGXI

Manufacturer Part#:

CYD36S72V18-167BGXI

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

CYPRESS

Description:

IC SRAM 36MBIT 167MHZ 484FBGA

Package:

MPORT

Datasheet:

CYD36S72V18-167BGXI Datasheet

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Quantity:

946 PCS


CYD36S72V18-167BGXI Images are for reference only.

CYD36S72V18-167BGXI


CAD Models 

There is no relevant information available for this part yet.


Product Attributes

Manufacturer:

CYPRESS

Product Category:

IC Chips

Series:

CYD36S72V18

Type:

Synchronous

Mfr Package Description:


Mounting Style:

SMD/SMT

Mounting Type:

Surface Mount

Access Time:

4 ns

Address Bus Width:

19 b

Brand:

Cypress Semiconductor

Mfr. Cage Code:

65786

Harmonized Code:

8542.32.00.41

REACH Compliant:

Yes

EU RoHS Compliant:

Yes

China RoHS Compliant:

Yes

Data Rate:

SDR

Density:

36 Mb

I/O Type:

COMMON

Interface Type:

Parallel

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Maximum Clock Frequency:

167 MHz

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Maximum Supply Current:

1.73 Amp

Maximum Operating Temperature:

+ 85 °C

Minimum Operating Temperature:

- 40 °C

Memory Size:

36 Mbit

Memory IC Type:

DUAL-PORT SRAM

Memory Density:

3.7748736E7 bit

Memory Width:

72

Moisture Sensitivity Level:

3

Number of Functions:

1

Number of Ports:

2

Number of Pins:

484

Number of Terminals:

484

Number of Words:

524288.0 words

Number of Words Code:

512K

Word Size:

72 b

Operating Mode:

SYNCHRONOUS

Organization:

512 k x 72

Output Characteristics:

3-STATE

Package / Case:

BGA-484

Packaging:

Tray

Mfr Package Description:

27 X 27 MM, 2.33 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484, 22X22, 40

Package Shape:

SQUARE

Package Style:

GRID ARRAY

Parallel/Serial:

PARALLEL

Peak Reflow Temperature (Cel):

260

Power Supplies (V):

1.5/1.8

Product Type:

SRAM

Seated Height-Max:

2.46 mm

Standby Current-Max:

0.7 Amp

Standby Voltage-Min:

1.4 V

Subcategory:

Memory & Data Storage

Supplier Device Package:

484-FBGA (23x23)

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Ball

Terminal Pitch:

1.0 mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

20

CNHTS:

8542319000

HTS Code:

8542320041

MXHTS:

85423299

Additional Feature:

PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8 V


Features

 True dual port memory enables simultaneous access the shared array from each port

 Synchronous pipelined operation with single data rate (SDR) operation on each port

 SDR interface at 200 MHz

● Up to 28.8 Gbps bandwidth (200 MHz × 72-bit × 2 ports)

 Selectable pipelined or flow-through mode

 1.5 V or 1.8 V core power supply

 Commercial and Industrial temperature

 IEEE 1149.1 JTAG boundary scan

 Available in 484-ball PBGA (× 72) and 256-ball FBGA (× 36 and × 18) packages

 FullFlex72 family

● 36-Mbit: 512K × 72 (CYD36S72V18)

● 18-Mbit: 256K × 72 (CYD18S72V18)

● 9-Mbit: 128K × 72 (CYD09S72V18)

 FullFlex36 family

● 36-Mbit: 1M × 36 (CYD36S36V18)

● 18-Mbit: 512K × 36 (CYD18S36V18)

● 9-Mbit: 256K × 36 (CYD09S36V18)

● 2-Mbit: 64K × 36 (CYD02S36V18)

 FullFlex18 family

● 36-Mbit: 2M × 18 (CYD36S18V18)

● 18-Mbit: 1M × 18 (CYD18S18V18)

● 9-Mbit: 512K × 18 (CYD09S18V18)

 Built-in deterministic access control to manage address collisions

● Deterministic flag output upon collision detection

● Collision detection on back-to-back clock cycles

● First busy address readback

 Advanced features for improved high-speed data transfer and flexibility

● Variable impedance matching (VIM)

● Echo clocks

● Selectable LVTTL (3.3 V), Extended HSTL[1] (1.4 V to 1.9 V), 1.8 V LVCMOS, or 2.5 V LVCMOS I/O on each port

● Burst counters for sequential memory access

● Mailbox with interrupt flags for message passing

● Dual chip enables for easy depth expansion


Functional Description

The FullFlex™ dual port SRAM families consist of 2-Mbit, 9-Mbit, 18-Mbit, and 36-Mbit synchronous, true dual-port static RAMs that are high-speed, low-power 1.8 V or 1.5 V CMOS. Two ports are provided, enabling simultaneous access to the array. Simultaneous access to a location triggers deterministic access control. For FullFlex72 these ports operate independently with 72-bit bus widths and each port is independently configured for two pipelined stages. Each port is also configured to operate in pipelined or flow through mode.

The advanced features include the following:

■ Built-in deterministic access control to manage address collisions during simultaneous access to the same memory location

■ Variable impedance matching (VIM) to improve data transmission by matching the output driver impedance to the line impedance

■ Echo clocks to improve data transfer

To reduce the static power consumption, chip enables power down the internal circuitry. The number of latency cycles, before a change in CE0 or CE1 enables or disables the databus, matches the number of cycles of read latency selected for the device. For a valid write or read to occur, activate both chip enable inputs on a port. 

Each port contains an optional burst counter on the input address register. After externally loading the counter with the initial address, the counter increments the address internally.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Compliance

Lead Free

Lead Free

Radiation Hardening

No

RoHS

Compliant


ECCN / UNSPSC

CNHTS

8542319000

HTS Code

8542320041

MXHTS

85423299


Environmental & Export Classifications

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Moisture Sensitivity Level(MSL)

3(168 Hours)


Documents & Media

Datasheet

CYDXXS72V18 Datasheet


Introduction to Purchasing

Stock: 946 Can Ship Immediately.

   KynixKynix Semiconductor Limited is one of the largest electronic component distributor in China.

The company was founded in 2008.

Goal: Strive to be the leading electronic component distributor of this industry and become the first one in the world.

Advantages: Professional workshops and rigorous management system.

Business Philosophy: We gain credibility by adhering to our commitments, displaying honesty and integrity and reaching company goals solely through honourable conduct.


Product Manufacturer

Cypress Semiconductor Corporation is an American semiconductor design and manufacturing company. It offers NOR flash memories, F-RAM and SRAM Traveo microcontrollers, and is the only PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions.

Its headquarters are in San Jose, California, and it has operations in the United States, Ireland, India and the Philippines.

Some of its main competitors include Microchip Technology, NXP, Renesas and Micron. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom's Wireless Internet of Things Business.


Product Range

Wireless Connectivity

Universal Serial Bus (USB)

memory

Wi-Fi + Bluetooth Combos

Hub Controllers

Serial NOR Flash Memory

Microcontrollers (MCUs)

Power Management

Touch Sensing

Clocks & Buffers

LED Lighting Driver IC

CapSense® Controllers


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

946

CYPRESS

IC SRAM 36MBIT 167MHZ 484FBGA

Mouser

0

Cypress Semiconductor

SRAM 36MB (512Kx72) 1.8v 167MHz Sync SRAM

Rochester Electronics

39

Cypress

Dual-Port SRAM, 512KX72, 4ns, CMOS, PBGA484


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

CYD36S72V18-167BGXI   Popularity by Region

CYD36S72V18-167BGXI   Popularity by Region


Market Price Analysis

CYD36S72V18-167BGXI   Market Price Analysis

CYD36S72V18-167BGXI   Market Price Analysis

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