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Oct 11 2019

XQV300-4PQ240N Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XQV300-4PQ240N

Manufacturer Part#:

XQV300-4PQ240N

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

-

Datasheet:

XQV300-4PQ240N Datasheet

Package:

QFP

Quantity:

455 PCS


XQV300-4PQ240N Images are for reference only.

XQV300-4PQ240N Image 


CAD Models

 XQV300-4PQ240N Symbol

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Package Description

PLASTIC, QFP-240

REACH Compliant

Yes

Status

End Of Life

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Base Part Number

XQV300

Delay Time tpd(1) Max

0.8 ns

JESD-30 Code

S-PQFP-G240

JESD-609 Code

e0

Moisture Sensitivity Level

3

Mounting Type

Surface Mount

Number of Terminals

240

Number of CLBs

1,536

Number of Gates

322,970

Number of Inputs

166

Number of Logic Cells

6,912

Number of Outputs

166

Operating Temperature

-55°C ~ 125°C (TJ)

Organization

1536 CLBS, 322970 GATES

Package Body Material

PLASTIC/EPOXY

Pbfree Code

No

Package Code

FQFP

Package Shape

SQUARE

Pin Count

240

PCB

240

Peak Reflow Temperature (Cel)

225

Packaging

Tray

Package Equivalence Code

QFP240,1.3SQ,20

Package Style

FLATPACK, FINE PITCH

Power Supplies

1.2/3.6,2.5 V

Qualification Status

Not Qualified

Rohs Code

No

Risk Rank  

5.27

Radiation Hardening

No

Seated Height-Max

4.1 mm

Speed Grade

4

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

2.5 V

Supply Voltage-Min

2.375 V

Supply Voltage-Max

2.625 V

Surface Mount

Yes

Screening Level

MIL-PRF-38535

Technology

CMOS

Temperature Grade

MILITARY

Terminal Form

GULL WING

Terminal Pitch

0.5 mm

Terminal Position

QUAD

Terminal Finish

Tin/Lead (Sn85Pb15)

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

32 mm

Width

32 mm


Features

• Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)

• Guaranteed over the full military temperature range (–55°C to +125°C)

• Ceramic and Plastic Packages

• Fast, high-density Field-Programmable Gate Arrays

- Densities from 100K to 1M system gates

- System performance up to 200 MHz

- Hot-swappable for Compact PCI

• Multi-standard SelectI/O™ interfaces

- 16 high-performance interface standards

- Connects directly to ZBTRAM devices

• Built-in clock-management circuitry

- Four dedicated delay-locked loops (DLLs) for advanced clock control

- Four primary low-skew global clock distribution nets, plus 24 secondary global nets

• Hierarchical memory system

- LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register

- Configurable synchronous dual-ported 4K-bit RAMs

- Fast interfaces to external high-performance RAMs

• Flexible architecture that balances speed and density

- Dedicated carry logic for high-speed arithmetic

- Dedicated multiplier support

- Cascade chain for wide-input functions

- Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset

- Internal 3-state bussing

- IEEE 1149.1 boundary-scan logic

- Die-temperature sensing device

• Supported by FPGA Foundation™ and Alliance Development Systems

- Complete support for Unified Libraries, Relationally Placed Macros, and Design Manager

- Wide selection of PC and workstation platforms

• SRAM-based in-system configuration

- Unlimited reprogrammability

- Four programming modes

• 0.22 µm 5-layer metal process

• 100% factory tested

• Available to Standard Microcircuit Drawings

- 5962-99572 for XQV300

- 5962-99573 for XQV600

- 5962-99574 for XQV1000


Advantages and Disadvantages

Advantages

The QPro™ Virtex™ FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 5-layer-metal 0.22 µm CMOS process. These advances make QPro Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A001.A.2.C

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

455 PCS

Xilinx, Inc.

-

Heisener Electronics

296 PCS

Xilinx, Inc.

IC FPGA 2.5V 300K GATES 240-BGA

Resion LLC

81 PCS

Xilinx, Inc.

-

Nexxon, Inc

In Stock

Xilinx, Inc.

-


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


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