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Oct 9 2019

XC3S1200E-4FGG400C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC3S1200E-4FGG400C

Manufacturer Part#:

XC3S1200E-4FGG400C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 304 I/O 400FBGA

Datasheet:

XC3S1200E-4FGG400C Datasheet

Package:

400-BGA

Quantity:

770 PCS


XC3S1200E-4FGG400C Images are for reference only.

XC3S1200E-4FGG400C Image 


CAD Models

 XC3S1200E-4FGG400C Symbol

XC3S1200E-4FGG400C Symbol

 XC3S1200E-4FGG400C Footprint

XC3S1200E-4FGG400C Footprint


Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Series

Spartan®-3E

Base Part Number

XC3S1200E

Brand  

Xilinx

Package Description

21 X 21 MM, 2.43 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-400

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Basic Package Type

Ball Grid Array

Clock Frequency-Max

572 MHz

Combinatorial Delay of a CLB-Max

0.76 ns

Data Rate

333 Mb/s

Distributed RAM      

136 kbit

Embedded Block RAM - EBR    

504 kbit

In System Programmability

Yes

JESD-30 Code

S-PBGA-B400

JESD-609 Code

e1

Moisture Sensitivity Level

3

Maximum Number of User I/Os

304

Maximum Internal Frequency

572 MHz

Number of CLBs/LABs

2,168

Number of Inputs

304

Number of Registers

17,344

Number of Logic Cells

19,512

Number of Logic Units

2,168

Number of Equivalent Gates

1,200,000

Number of Gates

1,200,000

Number of Outputs  

232

Number of Terminals

400

Number of I/O

304

Operating Temperature

0°C ~ 85°C (TJ)

Organization

2168 CLBS, 1200000 GATES

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Pbfree Code

Yes

Package Equivalence Code

BGA400,20X20,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

250

Packaging

Tray

Power Supplies

1.2,1.2/3.3,2.5 V

Product Dimensions

21 x 21 x 1.73 mm

Pin Count

400

PCB

400

Package / Case

400-BGA

Supplier Device Package

400-FBGA (21x21)

Qualification Status  

Not Qualified

RAM Bits

516,096 b

Rohs Code

Yes

Radiation Hardening

No

Risk Rank

1.6

RAM Bits

516,096

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.2 V

Supply Voltage-Min

1.14V

Supply Voltage-Max

1.26 V

Seated Height-Max

2.43 mm

Speed Grade

4

Screening Level

Commercial

Surface Mount  

Yes

Typical Operating Supply Voltage

1.2 V

Technology

CMOS

Temperature Grade

OTHER

Terminal Finish

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Pitch  

1.0 mm

Terminal Form

Ball

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

30

Tradename    

Spartan

Length

21 mm

Width

21 mm


Features

  • Very low cost, high-performance logic solution for high-volume, consumer-oriented applications

  • Proven advanced 90-nanometer process technology

  • Multi-voltage, multi-standard SelectIO™ interface pins

  • Up to 376 I/O pins or 156 differential signal pairs

  • LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards

  • 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling

  • 622+ Mb/s data transfer rate per I/O

  • True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O

  • Enhanced Double Data Rate (DDR) support

  • DDR SDRAM support up to 333 Mb/s

  • Abundant, flexible logic resources

  • Densities up to 33,192 logic cells, including optional shift register or distributed RAM support

  • Efficient wide multiplexers, wide logic

  • Fast look-ahead carry logic

  • Enhanced 18 x 18 multipliers with optional pipeline

  • IEEE 1149.1/1532 JTAG programming/debug port

  • Hierarchical SelectRAM™ memory architecture

  • Up to 648 Kbits of fast block RAM

  • Up to 231 Kbits of efficient distributed RAM

  • Up to eight Digital Clock Managers (DCMs)

  • Clock skew elimination (delay locked loop)

  • Frequency synthesis, multiplication, division

  • High-resolution phase shifting

  • Wide frequency range (5 MHz to over 300 MHz)

  • Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing

  • Configuration interface to industry-standard PROMs

  • Low-cost, space-saving SPI serial Flash PROM

  • x8 or x8/x16 parallel NOR Flash PROM

  • Low-cost Xilinx® Platform Flash with JTAG

  • Complete Xilinx ISE® and WebPACK™ software

  • MicroBlaze™ and PicoBlazeä embedded processor cores

  • Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)

  • Low-cost QFP and BGA packaging options

  • Common footprints support easy density migration

  • Pb-free packaging options


Advantages and Disadvantages

Advantages

The Spartan®-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The five-member family offers densities ranging from 100,000 to 1.6 million system gates.

The Spartan-3E family builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration. These Spartan-3E FPGA enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Because of their exceptionally low cost, Spartan-3E FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

Spartan-3E FPGA Family

PCN Design/Specification

FG(G) and BG(G) Wire Bond 25/Jan/2013

HTML Datasheet

Spartan-3E FPGA Family


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

770 PCS

Xilinx, Inc.

IC FPGA 304 I/O 400FBGA

Digi-Key

522 PCS

Xilinx, Inc.

IC FPGA 304 I/O 400FBGA

Avnet

Americas - 17

Asia - 0

Xilinx, Inc.

FPGA Spartan-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 400-Pin F-BGA - Trays (Alt: XC3S1200E-4FGG400C)

Mouser

96 PCS

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC3S1200E-4FGG400C Popularity by Region 

XC3S1200E-4FGG400C Popularity by Region


Market Price Analysis

XC3S1200E-4FGG400C Market Price Analysis 

XC3S1200E-4FGG400C Market Price Analysis


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