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Sep 12 2019

XC7VX550T-1FFG1927I Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7VX550T-1FFG1927I

Manufacturer Part#:

XC7VX550T-1FFG1927I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

IC FPGA 600 I/O 1927BGA

Datasheet:

XC7VX550T-1FFG1927I Datasheet

Package:

BGA

Quantity:

88 PCS


XC7VX550T-1FFG1927I Images are for reference only.

XC7VX550T-1FFG1927I Image 


CAD Models

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Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Virtex®-7 XT

Base Part Number

XC7VX550T

Package Description

FBGA-1927

REACH Compliant

Yes

EU RoHS Compliant

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

1,818 MHz

Combinatorial Delay of a CLB-Max

0.74 ns

Clock Management

MMCM, PLL

Data Rate

28.05 Gb/s

Distributed RAM

8725 kbit

Embedded Block RAM - EBR

42480 kbit

In System Programmability

Yes

JESD-30 Code

S-PBGA-B1927

JESD-609 Code

e1

Moisture Sensitivity Level

4

Maximum Number of User I/Os

600

Max Processing Temp

245

Number of CLBs

43,300

Number of Inputs

600

Number of Logic Cells

554,240

Number of Logic Units

346,400

Number of Registers

692,800

Number of Outputs  

600

Number of Terminals

1927

Number of Transceivers

48

Number of I/O

600

Number of Logic Blocks (LABs)

43,300

Operating Temperature

-40°C ~ 100°C (TJ)

Organization

43300 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Type

FCBGA

Pbfree Code

Yes

Propagation Delay

0.12 ns

Package Equivalence Code

BGA, BGA1924,44X44,40

Product Range

Virtex-7 XC7VX550T Series

Package Shape

SQUARE

Package Style

GRID ARRAY

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Packaging

Tray

Power Supplies

1,1.8 V

Product Dimensions

45 x 45 x 3.05(Max) mm

Pin Count

1927

PCB

1927

Package / Case

1924-BBGA, FCBGA

Supplier Device Package

1927-FCBGA (45 x 45)

Qualification Status  

Not Qualified

RAM Bits

43,499,520 b

Rohs Code

Yes

Risk Rank

5.72

Radiation Hardening

No

Sub Category

Field Programmable Gate Arrays

Seated Height-Max

3.65 mm

Supply Voltage-Nom

1.0 V

Supply Voltage-Min

0.97V

Supply Voltage-Max

1.03 V

Surface Mount  

Yes

Speed Grade

1

Typical Operating Supply Voltage

1.0 V

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Technology

CMOS

Tradename

Virtex

Terminal Form

Ball

Terminal Pitch  

1 mm

Turn-On Delay Time

0.12 ns

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

45 mm

Width

45 mm


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.

Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A001.A.7.B

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

Virtex-7 T/XT FPGA Datasheet

7 Series FPGA Overview

Product Training Modules

Powering Series 7 Xilinx FPGAs with TI Power Management Solutions

PCN Design/Specification

Zynq-7000 Datasheet Update 02/Jun/2014

PCN Assembly/Origin

Additional Wafer Fabrication 16/Dec/2013

Substrate Supplier Addition 03/Nov/2014


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Xilinx, Inc.

IC FPGA 600 I/O 1927BGA

Digi-Key

0

Xilinx, Inc.

IC FPGA 600 I/O 1927BGA

Avnet

Americas - 0

Xilinx, Inc.

FPGA Virtex-7 XT Family 554240 Cells 28nm Technology 1V 1927-Pin FCBGA - Trays (Alt: XC7VX550T-1FFG1927I)

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC7VX550T-1FFG1927I Popularity by Region

XC7VX550T-1FFG1927I Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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