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XC7VX485T-2FF1927C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Author: Apogeeweb
Date: 9 Sep 2019
 1327
Embedded - FPGAs (Field Programmable Gate Array)

Product Overview

Kynix Part #:

KY32-XC7VX485T-2FF1927C

Manufacturer Part#:

XC7VX485T-2FF1927C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

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Description:

-

Datasheet:

XC7VX485T-2FF1927C Datasheet

Package:

BGA

Quantity:

88 PCS


XC7VX485T-2FF1927C Images are for reference only.

XC7VX485T-2FF1927C Image 


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Virtex®-7 XT

Base Part Number

XC7VX485T

Package Description

FBGA-1924

REACH Compliant

Yes

Status

Active

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

1,818 MHz

Data Rate

28.05 Gb/s

Distributed RAM

8175 kbit

Embedded Block RAM - EBR

37080 kbit

In System Programmability

Yes

JESD-30 Code

S-PBGA-B1924

Lead Finish

Tin|Lead

Moisture Sensitivity Level

4

Maximum Number of User I/Os

600

Number of CLBs

37,950

Number of Inputs

600

Number of Logic Cells

485,760

Number of Logic Units

303,600

Number of Registers

607,200

Number of Outputs  

600

Number of Terminals

1924

Number of I/O

600

Number of Logic Blocks (LABs)

37,950

Operating Temperature

0°C ~ 85°C (TJ)

Organization

37,950 CLBS

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Type

FCBGA

Package Equivalence Code

BGA, BGA1924,44X44,40

Package Shape

SQUARE

Package Style

GRID ARRAY

Propagation Delay

0.1 ns

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Packaging

Tray

Power Supplies

1,1.8 V

Product Dimensions

45 x 45 x mm

Package / Case

1924-BBGA, FCBGA

Supplier Device Package

1927-FCBGA (45x45)

Qualification Status  

Not Qualified

RAM Bits

37,969,920 b

Rohs Code

No

Re-programmability Support

1

Risk Rank

5.84

Radiation Hardening

No

Sub Category

Field Programmable Gate Arrays

Supply Voltage-Nom

1.0 V

Supply Voltage-Min

0.97V

Supply Voltage-Max

1.03 V

Surface Mount  

Yes

Speed Grade

2

Screening Level

Commercial

Typical Operating Supply Voltage

1 V

Technology

CMOS

Terminal Form

Ball

Terminal Pitch  

1 mm

Terminal Position

Bottom

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Length

45 mm

Width

45 mm


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications.

Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance.


Applications

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Product Functions

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ECCN / UNSPSC

Description

Value

ECCN

3A991D

HTSN

8542.39.00.01

SCHEDULE B

8542.39.00.00


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Xilinx, Inc.

-

Digi-Key

0

Xilinx, Inc.

-

Avnet

Americas - 16

Europe - 0

Xilinx, Inc.

-

Mouser

0

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

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Popularity by Region

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Market Price Analysis

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