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Dec 19 2018

A3PE3000L-FG484M Price|A3PE3000L-FG484M Description| Microsemi Corporation| Datasheets|In Stock

Product Overview

Kynix Part #:

KY32-A3PE3000L-FG484M

Manufacturer Part#:

A3PE3000L-FG484M

Product Category:

Embedded - FPGAs (Field Programmable Gate Array)

Stock:

Yes

Manufacturer:

Microsemi Corporation

Click Purchase button to buy original genuine A3PE3000L-FG484M

A3PE3000L-FG484M 

Description:

IC FPGA 341 I/O 484FBGA

Datasheet

A3PE3000L-FG484M Datasheet

Package:

484-BGA

Quantity:

176 PCS


A3PE3000L-FG484M Images are for reference only.

A3PE3000L-FG484M


CAD Models

A3PE3000L-FG484M footprint

A3PE3000L-FG484M Footprint


Product Attributes

Type:

Electronic Component

Product Category:

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer:

Microsemi Corporation

Unit-Weight:

0.014110 oz

Mounting-Style:

SMD/SMT

Tradename:

Actel

Package-Case:

484-BGA

Operating-Temperature:

-55°C ~ 125°C (TJ)

Mounting-Type:

Surface Mount

Voltage-Supply:

1.425 V ~ 1.575 V

Supplier-Device-Package:

484-FPBGA (23x23)

Number-of-Gates:

3000000

Number-of-I-O:

341

Number-of-LABs-CLBs:

-----

Number-of-Logic-Elements-Cells:

-----

Total-RAM-Bits:

516096

Maximum-Operating-Temperature:

+ 125 C

Minimum-Operating-Temperature:

- 55 C

Operating-Supply-Voltage:

1.2 V 1.5 V

Package-Case:

FBGA

Number-of-I-Os:

341 I/O

Part Status:

Active

Number of Pins:

484

Number of Registers:

75264

RAM Size:

516096 b

RoHS:

N

Brand:

Microsemi

CNHTS:

8542390000

HTS Code:

8542310001

Product Type:

FPGA - Field Programmable Gate Array

Subcategory:

Programmable Logic ICs

Tradename:

ProASIC3

Clock Frequency-Max:

250.0  MHz

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e0

Moisture Sensitivity Level:

3

Number of Inputs:

341.0

Number of Outputs:

341.0

Number of Terminals:

484

Organization:

75264 CLBS, 3000000 GATES

Power Supplies:

1.2/1.5,1.2/3.3

Qualification Status:

Not Qualified

Seated Height-Max:

2.44  mm

Technology :

CMOS

Temperature Grade:

MILITARY

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

1.0  mm

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max (s):

30

Length:

23.0  mm

Width:

23.0  mm


Features

Military Temperature Tested and Qualified

• Each Device Tested from –55°C to 125°C

Firm-Error Immune

• Not Susceptible to Neutron-Induced Configuration Loss

Low Power

• Dramatic Reduction in Dynamic and Static Power

• 1.2 V to 1.5 V Core and I/O Voltage Support for Low Power†

• Low Power Consumption in Flash*Freeze Mode Allows for

Instantaneous Entry To / Exit From Low-Power Flash*Freeze

Modeƒ

• Supports Single-Voltage System Operation

• Low-Impedance Switches

High Capacity

• 600 k to 3 M System Gates

• Up to 504 kbits of True Dual-Port SRAM

• Up to 620 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Live-at-Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz (1.5 V systems) and 250 MHz (1.2 V systems) System

Performance

• 3.3 V, 66 MHz, 66-Bit PCI (1.5 V systems) and 66 MHz, 32-Bit

PCI (1.2 V systems)

In-System Programming (ISP) and Security

• Secure ISP Using On-Chip 128-Bit Advanced Encryption

Standard (AES) Decryption via JTAG (IEEE 1532–compliant)

• FlashLock® to Secure FPGA Contents

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

• High-Performance, Low-Skew Global Network

• Architecture Supports Ultra-High Utilization 


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

There is no relevant information available for this part yet.


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant


Documents & Media

Datasheets

Military ProASIC3/EL Devices

Design Resources

Development Tool Selector




PCN Design/Specification

Gold to Palladium Coated Copper Wire Chg 5/Nov/2015

Mult Dev Design Advisory 13/Oct/2017

Mult Devices Des Chg 17/Nov/2017

Mult Dev Software Chg 8/Oct/2018

PCN Assembly/Origin

ProASIC3/IGLOO 02/May/2017


Introduction to Purchasing

Stock: 176 Can Ship Immediately.

KynixKynix Semiconductor Limited is one of the largest electronic component distributor in China.

The company was founded in 2008.

Goal: Strive to be the leading electronic component distributor of this industry and become the first one in the world.

Advantages: Professional workshops and rigorous management system.

Business Philosophy: We gain credibility by adhering to our commitments, displaying honesty and integrity and reaching company goals solely through honourable conduct.


Product Manufacturer

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 4,800 employees globally.

Product Range

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Memory Cards, Modules (2)

Power Supplies - External/Internal (Off-Board) (14)

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Uncategorized (194)

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Optoelectronics (175)

RF/IF and RFID (150)


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

173

Microsemi Corporation

IC FPGA 341 I/O 484FBGA

Digikey

0

Microsemi Corporation

IC FPGA 341 I/O 484FBGA

Mouser

60

Microsemi

FPGA - Field Programmable Gate Array ProASIC3


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

Popularity by Region

Market Price Analysis

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