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Dec 18 2018

MT29C4G96MAZAPCJG Price|MT29C4G96MAZAPCJG Description|MICRON| Datasheets|In Stock

Product Overview

Kynix Part #:

KY32-MT29C4G96MAZAPCJG

Manufacturer Part#:

MT29C4G96MAZAPCJG

Product Category:

Memory

Stock:

Yes

Manufacturer:

Micron Technology Inc.

Click Purchase button to buy original genuine MT29C4G96MAZAPCJG

MT29C4G96MAZAPCJG 

Description:

IC FLASH RAM 4G PARAL 168VFBGA

Detailed Description:

FLASH - NAND, Mobile LPDRAM Memory IC 4Gb (256M x 16)(NAND), 4Gb (128M x 32)(LPDRAM) Parallel 200MHz 168-VFBGA (12x12)

Datasheet:

MT29C4G96MAZAPCJG Datasheet

Package:

BGA

Quantity:

9773 PCS

Lead Free Status / RoHS Status:

Lead free / RoHS Compliant

Moisture Sensitivity Level(MSL):

3(168 Hours)


MT29C4G96MAZAPCJG Images are for reference only

MT29C4G96MAZAPCJG


CAD Models

There is no relevant information available for this part yet.


Product Attributes

Type

Electronic Component

Categories

Integrated Circuits (ICs)

Memory

Manufacturer

Micron Technology Inc.

Lead Finish

Tin/Silver/Copper

Max Processing Temp

260

Mounting

Surface Mount

Pin Count

168

Product Dimensions

12 x 12 x 0.9 mm

Series

---

Part Status

Obsolete

Memory Type

Non-Volatile

Memory Format

FLASH, RAM

Technology

FLASH - NAND, Mobile LPDRAM

Memory Size

4Gb (256M x 16)(NAND), 4Gb (128M x 32)(LPDRAM)

Clock Frequency

200MHz

Write Cycle Time - Word, Page

---

Memory Interface

Parallel

Voltage - Supply

1.7 V ~ 1.95 V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

168-VFBGA

Supplier Device Package

168-VFBGA (12x12)

Certifications

EU RoHS

Lead Shape

Ball


Features

Micron® NAND Flash and Mobile LPDRAM components.

RoHS-compliant, “green” package.

Separate NAND Flash and Mobile LPDRAM interfaces.

Space-saving package-on-package combination.

Low-voltage operation (1.70-1.95V).

Industrial temperature range: -40°C to +85°C.


Advantages and Disadvantages

There is no relevant information available for this part yet.


Application Notes

Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members of the discrete memory products portfolio.

The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate NAND Flash and Mobile LPDRAM buses. The NAND Flash and Mobile LPDRAM devices have separate core power connections and share a common ground (i.e., VSS is tied together on the two devices).


ECCN / UNSPSC

ECCN:

3A991

HTSN:

8542320071

SCHEDULE B:

8542320070

UNSPSC VERSION:

V15.1101

UNSPSC:

32101600


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Documents & Media

Datasheets

MT29CxGxxMAxBAxx-5_WT,IT


PCN Obsolescence/ EOL

Multiple Devices 02/Jan/2014

Revision to Replacements 11/Mar/2014

Revision 2 Replacements 31/Jul/2014


Introduction to Purchasing

Stock: 9773 Can Ship Immediately

KynixKynix Semiconductor Limited is one of the largest electronic component distributor in China.

The company was founded in 2008.

Goal: Strive to be the leading electronic component distributor of this industry and become the first one in the world.

Advantages: Professional workshops and rigorous management system.

Business Philosophy: We gain credibility by adhering to our commitments, displaying honesty and integrity and reaching company goals solely through honourable conduct.


Product Manufacturer

Micron Technology, Inc. is an American global corporation based in Boise, Idaho. The company produces many forms of semiconductor devices, including dynamic random-access memory, flash memory, and solid-state drives. Its consumer products are marketed under the brands Crucial and Ballistix. Micron and Intel together created IM Flash Technologies, which produces NAND flash memory. It owned Lexar between 2006 and 2017.

Product Range

Memory

Storage

Advanced Solutions

DRAM

Memory Cards

3D XPoint™ Technology

Graphics Memory

Solid State Drives

Authenta


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix

9773

Micron Technology, Inc.

IC FLASH RAM 4G PARAL 168VFBGA

Digikey

0

Micron Technology, Inc.

IC FLASH RAM 4G PARAL 168VFBGA

Digipart

1000

Micron Technology, Inc.

---


Product Functions

Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members of the discrete memory products portfolio.

The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate NAND Flash and Mobile LPDRAM buses. The NAND Flash and Mobile LPDRAM devices have separate core power connections and share a common ground (i.e., VSS is tied together on the two devices).


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


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