Product Overview
Kynix Part #: | KY32-XC7VX330T-2FF1761I |
Manufacturer Part#: | XC7VX330T-2FF1761I |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | Xilinx Inc. |
Click Purchase button to buy original genuine XC7VX330T-2FF1761I | |
Description: | - |
Datasheet: | XC7VX330T-2FF1761I Datasheet |
Package: | BGA |
Quantity: | 88 PCS |
XC7VX330T-2FF1761I Images are for reference only.
CAD Models
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Product Attributes
Categories | Integrated Circuits (ICs) Embedded - FPGAs (Field Programmable Gate Array) |
Manufacturer | Xilinx Inc. |
Series | Virtex®-7 XT |
Base Part Number | XC7VX330T |
Package Description | FBGA-1760 |
REACH Compliant | Yes |
Status | Active |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Clock Frequency-Max | 1,818 MHz |
Clock Management | MMCM, PLL |
Distributed RAM | 4,388 kbit |
Embedded Block RAM - EBR | 27,000 kbit |
In System Programmability | Yes |
JESD-30 Code | S-PBGA-B1760 |
Lead Finish | Tin|Lead |
Moisture Sensitivity Level | 4 |
Max Processing Temp | 220 |
Maximum Number of User I/Os | 650 |
Number of CLBs | 25,500 |
Number of Inputs | 650 |
Number of Logic Cells | 326,400 |
Number of Logic Units | 204,000 |
Number of Outputs | 650 |
Number of Terminals | 1760 |
Number of I/O | 650 |
Number of Logic Blocks (LABs) | 25,500 |
Number of Registers | 408,000 |
Operating Temperature | -40°C ~ 100°C (TJ) |
Organization | 25,500 CLBS |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Packaging | Tray |
Product Range | Virtex-7 XC7VX330T Series |
Package Type | FCBGA |
Package Equivalence Code | BGA, BGA1760,42X42,40 |
Product Dimensions | 42.5 x 42.5 x 2.9 mm |
Package Shape | SQUARE |
Product Type | FPGA - Field Programmable Gate Array |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supplies | 1,1.8 V |
Pin Count | 1760 |
PCB | 1760 |
Package / Case | 1760-BBGA, FCBGA |
Supplier Device Package | 1761-FCBGA (42.5x42.5) |
Qualification Status | Not Qualified |
RAM Bits | 27,648,000 b |
Radiation Hardening | No |
Re-programmability Support | 1 |
Rohs Code | No |
Risk Rank | 5.85 |
Sub Category | Field Programmable Gate Arrays |
Supply Voltage-Nom | 1.0 V |
Supply Voltage-Min | 0.97 V |
Supply Voltage-Max | 1.03 V |
Speed Grade | 2 |
Surface Mount | Yes |
Screening Level | Industrial |
Technology | CMOS |
Terminal Form | Ball |
Terminal Pitch | 1.0 mm |
Terminal Position | Bottom |
Turn-On Delay Time | 0.1 ns |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Typical Operating Supply Voltage | 1.0 V |
Tradename | Virtex |
Length | 42.5 mm |
Width | 42.5 mm |
Features
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
Advantages and Disadvantages
Advantages
Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Applications
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Product Functions
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ECCN / UNSPSC
Description | Value |
ECCN | 3A991.D |
HTSN | 8525601050 |
SCHEDULE B | 8525601025 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributor | Stock | Manufacturer | Descriptions |
Kynix Semiconductor | 88 PCS | Xilinx, Inc. | - |
Digi-Key | 0 | Xilinx, Inc. | IC FPGA 650 I/O 1761FCBGA |
Avnet | Americas - 0 | Xilinx, Inc. | FPGA Virtex-7 XT Family 326400 Cells 28nm Technology 1V 1761-Pin FCBGA - Trays (Alt: XC7VX330T-2FF1761I) |
Alternative Models
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Popularity by Region
XC7VX330T-2FF1761I Popularity by Region
Market Price Analysis
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