Product Overview
Kynix Part#: | KY32-XC3S200AN-5FTG256C |
Manufacturer Part#: | XC3S200AN-5FTG256C |
Product Category: | IC Chips |
Stock: | Yes |
Manufacturer: | XILINX |
Click Purchase button to buy original genuine XC3S200AN-5FTG256C |
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Description: | - |
Datasheet: | XC3S200AN-5FTG256C Datasheet |
Package: | BGA |
Quantity: | 2340 PCS |
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Product Attributes
Manufacturer: | Xilinx |
Product Category: | IC Chips |
Status: | Active |
Series: | Spartan®-3AN |
Clock Frequency-Max: | 320.0 MHz |
Distributed RAM: | 28 kbit |
Device Logic Cells: | 74,637 |
Device Logic Units: | 74,637 |
EU RoHS Compliant: | Yes |
Embedded Block RAM - EBR: | 288 kbit |
In System Programmability: | No |
.JESD-30 Code: | S-PBGA-B256 |
JESD-609 Code: | e1 |
Length: | 17.0 mm |
Lead Finish: | Tin/Silver/Copper |
Mounting Type: | Surface Mount |
Mounting Style: | SMD/SMT |
Maximum Internal Frequency: | 280 MHz |
Max Processing Temp: | 260 |
Number of I/O: | 195 |
Number of CLBs: | 448.0 |
Number of Gates: | 200000 |
Number of Inputs: | 195.0 |
Number of Outputs: | 195.0 |
Number of Terminals: | 256 |
Number of Logic Cells: | 4032 |
Organization: | 448 CLBS, 200000 GATES |
Operating Temperature-Min: | 0.0 °C |
Operating Temperature-Max: | 85.0 °C |
Pin Count: | 484 |
Product Type: | FPGA - Field Programmable Gate Array |
Package / Case: | 256-LBGA |
Package Code: | LBGA |
Package Style: | GRID ARRAY, LOW PROFILE |
Package Shape: | SQUARE |
Package Body Material: | PLASTIC/EPOXY |
Package Equivalence Code: | BGA256,16X16,40 |
Programmable Logic Type: | FIELD PROGRAMMABLE GATE ARRAY |
Peak Reflow Temperature: | 260 |
RAM Bits: | 3,170,304 Bit |
REACH Compliant: | Yes |
Speed Grade: | 2 |
Sub Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
Screening Level: | Industrial |
Seated Height-Max: | 1.55 mm |
Supply Voltage-Nom: | 3.3 V |
Supply Voltage-Min: | 3.0 V |
Supply Voltage-Max: | 3.6 V |
Supplier Device Package: | 256-FTBGA (17x17) |
Tradename: | Spartan |
Technology : | CMOS |
Total RAM Bits: | 294912 |
Terminal Form: | BALL |
Terminal Pitch: | 1.0 mm |
Terminal Finish: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
Terminal Position: | BOTTOM |
Time@Peak Reflow Temperature-Max: | 30 |
Voltage - Supply: | 3.0V ~ 3.6V |
Width: | 17.0 mm |
Product Features
• Very low-cost, high-performance logic solution for highvolume, cost-conscious applications
- Use fewer standard components
- Increase system reliability
• Flexible power management
- Low 1.2V core voltage
- Selectable I/O voltage with 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
- Full 3.3V ±10% compatibility and hot swap compliance
- Dual-range auxiliary voltage allows 3.3V setting to simplify 3.3V-only design
- Suspend and hibernate modes reduce system power
• Leading connectivity platform
- Multi-standard SelectIO™ interface pins support most popular and emerging signaling standards
- Up to 519 I/O pins or 227 differential signal pairs
- LVCMOS, LVTTL, HSTL, SSTL single-ended I/O
- Selectable output drive, up to 24 mA per pin
- QUIETIO standard reduces I/O switching noise
- 640+ Mb/s data transfer rate per differential I/O
- LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors
- Enhanced Double Data Rate (DDR) support
- Compliant to 32-/64-bit, 33/66 MHz PCI™ technology
• Abundant, flexible logic resources
- Densities up to 53,712 logic cells, including optional shift register or distributed RAM support
- Efficient wide multiplexers and wide logic improve performance and density
- Fast look-ahead carry logic
- IEEE 1149.1/1532 JTAG programming/debug port
• Dedicated resources for high-speed digital signal processing applications
- 18-bit by 18-bit multiplier with optional pipeline
- 250 MHz XtremeDSP™ DSP48A block in the largest two devices
· 48-bit accumulator for multiply-accumulate (MAC) operation
· Integrated 18-bit pre-adder for multiply or multiply-add operation
· Optional cascaded Multiply or MAC
· Fills the DSP performance gap between DSP processors and high-end custom solutions
• Precise clock management with up to eight Digital Clock Managers (DCMs)
- Clock skew elimination (delay locked loop)
- Frequency synthesis, multiplication, division
- High-resolution phase shifting
- Wide frequency range (5 MHz to over 320 MHz)
• Integrated flash memory in Spartan-3AN devices
- Up to 16 Mb of internal flash for configuration and application storage
- Up to 11 Mb of user storage available for embedded processing, code shadowing, or scratchpad memory
- Enables single-chip board designs for spaceconscious applications
- Enhanced design security with flash memory protection and security register
• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing
• Hierarchical SelectRAM memory architecture
- Up to 2.2 Mb of fast block RAM with byte write enables for processor applications
- Up to 373 Kb of efficient distributed RAM
- External DDR/DDR2 SDRAM support up to 400 Mb/s
- Configuration interface to industry-standard PROMs
- Low-cost, space-saving SPI serial flash PROM
- x8 or x8/x16 parallel NOR flash PROM
- Low-cost Xilinx Platform Flash with JTAG
- Load multiple bitstreams under FPGA control with MultiBoot capability
• Complete Xilinx ISE and free WebPACK development system software support
- Industry’s most comprehensive IP library
• MicroBlaze and PicoBlaze embedded processors
- Integrate soft processor into FPGA to reduce Bill of Materials
- Reduce obsolescence risks with soft processors
• Low-cost QFP and BGA packaging, Pb-free options
- Common footprints support easy density migration
• Low-cost starter kits from Xilinx, distributors, and third parties
- Complete starter kits designed for cost-sensitive, high-volume applications with design examples
• XA versions available for Automotive applications
Product Functions
There is no relevant information available for this part yet.
Applications
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Advantages and Disadvantages
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ECCN / UNSPSC
ECCN: | EAR99 |
HTSN: | 8542390001 |
SCHEDULE B: | 8542390000 |
Environmental & Export Classifications
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
Product Compliance
USHTS: | 8542390001 |
TARIC: | 8542399000 |
Documents & Media
Product Manufacturer
Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.
Product Range
Devices | Boards | Developer Tools |
ACAPs | Accelerator Cards | Vivado Design Suite - HLx Editions |
FPGAs & 3D ICs | Evaluation Boards | SDAccel Development Environment |
SoCs, MPSoCs & RFSoCs | System-on-Modules (SoMs) | SDSoC Development Environment |
Distributors
Distributors | Stock | Manufacturers | Descriptions |
Kynix | 2340 | XILINX | - |
DigiKey | 192 | Xilinx Inc. | IC FPGA 195 I/O 256FTBGA |
Mouser | 87 | Xilinx | FPGA - Field Programmable Gate Array XC3S200AN-5FTG256C |
Alternative Models
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Popularity by Region
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Market Price Analysis
XC3S200AN-5FTG256C Market Price Analysis
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