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XC3S200AN-5FTG256C Datasheets| XILINX| PDF| Price| In Stock

Author: Apogeeweb
Date: 16 Aug 2019
 1602
IC Chips


Product Overview

Kynix Part#:

KY32-XC3S200AN-5FTG256C

Manufacturer Part#:

XC3S200AN-5FTG256C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

Click Purchase button to buy original genuine

XC3S200AN-5FTG256C

purchase

Description:

-

Datasheet:

XC3S200AN-5FTG256C Datasheet

Package:

BGA

Quantity:

2340 PCS


XC3S200AN-5FTG256C Images are for reference only:

XC3S200AN-5FTG256C


CAD Models

XC3S200AN-5FTG256C Symbol

XC3S200AN-5FTG256C Symbol

XC3S200AN-5FTG256C Footprint

XC3S200AN-5FTG256C Footprint


Product Attributes

Manufacturer:

Xilinx

Product Category:

IC Chips

Status:

Active

Series:

Spartan®-3AN

Clock Frequency-Max:

320.0 MHz

Distributed RAM:

28 kbit

Device Logic Cells:

74,637

Device Logic Units:

74,637

EU RoHS Compliant:

Yes

Embedded Block RAM - EBR:

288 kbit

In System Programmability:

No

.JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17.0 mm

Lead Finish:

Tin/Silver/Copper

Mounting Type:

Surface Mount

Mounting Style:

SMD/SMT

Maximum Internal Frequency:

280 MHz

Max Processing Temp:

260

Number of I/O:

195

Number of CLBs:

448.0

Number of Gates:

200000

Number of Inputs:

195.0

Number of Outputs:

195.0

Number of Terminals:

256

Number of Logic Cells:

4032

Organization:

448 CLBS, 200000 GATES

Operating Temperature-Min:

0.0 °C

Operating Temperature-Max:

85.0 °C

Pin Count:

484

Product Type:

FPGA - Field Programmable Gate Array

Package / Case:

256-LBGA

Package Code:

LBGA

Package Style:

GRID ARRAY, LOW PROFILE

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA256,16X16,40

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

260

RAM Bits:

3,170,304 Bit

REACH Compliant:

Yes

Speed Grade:

2

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Screening Level:

Industrial

Seated Height-Max:

1.55 mm

Supply Voltage-Nom:

3.3 V

Supply Voltage-Min:

3.0 V

Supply Voltage-Max:

3.6 V

Supplier Device Package:

256-FTBGA (17x17)

Tradename:

Spartan

Technology :

CMOS

Total RAM Bits:

294912

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30

Voltage - Supply:

3.0V ~ 3.6V

Width:

17.0 mm


Product Features

• Very low-cost, high-performance logic solution for highvolume, cost-conscious applications

- Use fewer standard components

- Increase system reliability

• Flexible power management

- Low 1.2V core voltage

- Selectable I/O voltage with 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling

- Full 3.3V ±10% compatibility and hot swap compliance

- Dual-range auxiliary voltage allows 3.3V setting to simplify 3.3V-only design

- Suspend and hibernate modes reduce system power

• Leading connectivity platform

- Multi-standard SelectIO™ interface pins support most popular and emerging signaling standards

- Up to 519 I/O pins or 227 differential signal pairs

- LVCMOS, LVTTL, HSTL, SSTL single-ended I/O

- Selectable output drive, up to 24 mA per pin

- QUIETIO standard reduces I/O switching noise

- 640+ Mb/s data transfer rate per differential I/O

- LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors

- Enhanced Double Data Rate (DDR) support

- Compliant to 32-/64-bit, 33/66 MHz PCI™ technology

• Abundant, flexible logic resources

- Densities up to 53,712 logic cells, including optional shift register or distributed RAM support

- Efficient wide multiplexers and wide logic improve performance and density

- Fast look-ahead carry logic

- IEEE 1149.1/1532 JTAG programming/debug port

• Dedicated resources for high-speed digital signal processing applications

- 18-bit by 18-bit multiplier with optional pipeline

- 250 MHz XtremeDSP™ DSP48A block in the largest two devices

· 48-bit accumulator for multiply-accumulate (MAC) operation

· Integrated 18-bit pre-adder for multiply or multiply-add operation

· Optional cascaded Multiply or MAC

· Fills the DSP performance gap between DSP processors and high-end custom solutions

• Precise clock management with up to eight Digital Clock Managers (DCMs)

- Clock skew elimination (delay locked loop)

- Frequency synthesis, multiplication, division

- High-resolution phase shifting

- Wide frequency range (5 MHz to over 320 MHz)

• Integrated flash memory in Spartan-3AN devices

- Up to 16 Mb of internal flash for configuration and application storage

- Up to 11 Mb of user storage available for embedded processing, code shadowing, or scratchpad memory

- Enables single-chip board designs for spaceconscious applications

- Enhanced design security with flash memory protection and security register

• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing

• Hierarchical SelectRAM memory architecture

- Up to 2.2 Mb of fast block RAM with byte write enables for processor applications

- Up to 373 Kb of efficient distributed RAM

- External DDR/DDR2 SDRAM support up to 400 Mb/s

- Configuration interface to industry-standard PROMs

- Low-cost, space-saving SPI serial flash PROM

- x8 or x8/x16 parallel NOR flash PROM

- Low-cost Xilinx Platform Flash with JTAG

- Load multiple bitstreams under FPGA control with MultiBoot capability

• Complete Xilinx ISE and free WebPACK development system software support

- Industry’s most comprehensive IP library

• MicroBlaze and PicoBlaze embedded processors

- Integrate soft processor into FPGA to reduce Bill of Materials

- Reduce obsolescence risks with soft processors

• Low-cost QFP and BGA packaging, Pb-free options

- Common footprints support easy density migration

• Low-cost starter kits from Xilinx, distributors, and third parties

- Complete starter kits designed for cost-sensitive, high-volume applications with design examples

• XA versions available for Automotive applications


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

EAR99

HTSN:

8542390001

SCHEDULE B:

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

USHTS:

8542390001

TARIC:

8542399000


Documents & Media

Datasheets

Spartan-3A FPGA Datasheet

Spartan-3A Brochure

Extended Spartan-3A Family Overview

Spartan-3/3A/3E FPGA User Guide

Design Resources

Development Tool Selector

EDA / CAD Models

Download from Ultra Librarian


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

2340

XILINX

-

DigiKey

192

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

Mouser

87

Xilinx

FPGA - Field Programmable Gate Array XC3S200AN-5FTG256C


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

XC3S200AN-5FTG256C Market Price Analysis

XC3S200AN-5FTG256C Market Price Analysis


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