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Aug 14 2019

XC6SLX100T-3FGG484I Datasheets| XILINX| PDF| Price| In Stock


Product Overview

Kynix Part#:

KY32-XC6SLX100T-3FGG484I

Manufacturer Part#:

XC6SLX100T-3FGG484I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

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Description:

-

Datasheet:

XC6SLX100T-3FGG484I Datasheet

Package:

BGA

Quantity:

73 PCS


XC6SLX100T-3FGG484I Images are for reference only:

XC6SLX100T-3FGG484I


CAD Models

XC6SLX100T-3FGG484I Symbol

XC6SLX100T-3FGG484I Symbol

XC6SLX100T-3FGG484I Footprint.png

XC6SLX100T-3FGG484I Symbol


Product Attributes

Manufacturer:

XILINX

Product Category:

IC Chips

Status:

Active

Series:

Spartan®-6 LXT

Clock Frequency-Max:

862.0 MHz

Data Rate:

800 Mb/s

Distributed RAM:

976 kbit

Device Logic Cells:

101,261

Device Logic Units:

101,261

EU RoHS Compliant:

Yes

Embedded Block RAM - EBR:

4824 kbit

In System Programmability:

No

.JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Length:

23.0 mm

Lead Finish:

Tin/Silver/Copper

Mounting Type:

Surface Mount

Mounting Style:

SMD/SMT

Maximum Operating Frequency:

1080 MHz

Max Processing Temp:

250

Number of I/O:

296

Number of CLBs:

7911.0

Number of Inputs:

296.0

Number of Outputs:

296.0

Number of Terminals:

484

Number of Logic Cells:

101261

Organization:

7911 CLBS

Operating Temperature-Min:

-40.0 °C

Operating Temperature-Max:

100.0 °C

Pin Count:

484

Product Type:

FPGA - Field Programmable Gate Array

Package / Case:

484-BBGA

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA484,22X22,40

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

250

RAM Bits:

4,939,776 Bit

REACH Compliant:

Yes

Speed Grade:

3

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Screening Level:

Industrial

Seated Height-Max:

2.6 mm

Supply Voltage-Nom:

1.2 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Max:

1.26 V

Supplier Device Package:

484-FBGA (23x23)

Tradename:

Spartan

Technology:

CMOS

Temperature Grade:

INDUSTRIAL

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30

Voltage - Supply:

1.14V ~ 1.26V

Width:

23.0 mm


Product Features

• Spartan-6 Family:

- Spartan-6 LX FPGA: Logic optimized

- Spartan-6 LXT FPGA: High-speed serial connectivity

• Designed for low cost

- Multiple efficient integrated blocks

- Optimized selection of I/O standards

- Staggered pads

- High-volume plastic wire-bonded packages

• Low static and dynamic power

- 45 nm process optimized for cost and low power

- Hibernate power-down mode for zero power

- Suspend mode maintains state and configuration with multi-pin wake-up, control enhancement

- Lower-power 1.0V core voltage (LX FPGAs, -1L only)

- High performance 1.2V core voltage (LX and LXT FPGAs, -2, -3, and -3N speed grades)

• Multi-voltage, multi-standard SelectIO™ interface banks

- Up to 1,080 Mb/s data transfer rate per differential I/O

- Selectable output drive, up to 24 mA per pin

- 3.3V to 1.2V I/O standards and protocols

- Low-cost HSTL and SSTL memory interfaces

- Hot swap compliance

- Adjustable I/O slew rates to improve signal integrity

• High-speed GTP serial transceivers in the LXT FPGAs

- Up to 3.2 Gb/s

- High-speed interfaces including: Serial ATA, Aurora, 1G Ethernet, PCI Express, OBSAI, CPRI, EPON, GPON, DisplayPort, and XAUI

• Integrated Endpoint block for PCI Express designs (LXT)

• Low-cost PCI® technology support compatible with the 33 MHz, 32- and 64-bit specification.

• Efficient DSP48A1 slices

- High-performance arithmetic and signal processing

- Fast 18 x 18 multiplier and 48-bit accumulator

- Pipelining and cascading capability

- Pre-adder to assist filter applications

• Integrated Memory Controller blocks

- DDR, DDR2, DDR3, and LPDDR support

- Data rates up to 800 Mb/s (12.8 Gb/s peak bandwidth)

- Multi-port bus structure with independent FIFO to reduce design timing issues

• Abundant logic resources with increased logic capacity

- Optional shift register or distributed RAM support

- Efficient 6-input LUTs improve performance and minimize power

- LUT with dual flip-flops for pipeline centric applications

• Block RAM with a wide range of granularity

- Fast block RAM with byte write enable

- 18 Kb blocks that can be optionally programmed as two independent 9 Kb block RAMs

• Clock Management Tile (CMT) for enhanced performance

- Low noise, flexible clocking

- Digital Clock Managers (DCMs) eliminate clock skew and duty cycle distortion

- Phase-Locked Loops (PLLs) for low-jitter clocking

- Frequency synthesis with simultaneous multiplication, division, and phase shifting

- Sixteen low-skew global clock networks

• Simplified configuration, supports low-cost standards

- 2-pin auto-detect configuration

- Broad third-party SPI (up to x4) and NOR flash support

- Feature rich Xilinx Platform Flash with JTAG

- MultiBoot support for remote upgrade with multiple bitstreams, using watchdog protection

• Enhanced security for design protection

- Unique Device DNA identifier for design authentication

- AES bitstream encryption in the larger devices

• Faster embedded processing with enhanced, low cost, MicroBlaze™ soft processor

• Industry-leading IP and reference designs


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991.D

HTSN:

8542390001

SCHEDULE B:

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

USHTS:

8542390001

TARIC:

8542399000


Documents & Media

Datasheets

Spartan-6 FPGA Datasheet

Spartan-6 Family Overview

Design Resources

Development Tool Selector

PCN Design/Specification

FG(G) and BG(G) Wire Bond 25/Jan/2013


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

73

XILINX

-

DigiKey

0

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

Mouser

60

Xilinx

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

XC6SLX100T-3FGG484I Market Price Analysis

XC6SLX100T-3FGG484I Market Price Analysis


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