Home  Electronic Components and Parts Search

Aug 13 2019

XC7K70T-2FBG484C Datasheets| Xilinx Inc.| PDF| Price| In Stock

Product Overview

Kynix Part #:

KY32-XC7K70T-2FBG484C

Manufacturer Part#:

XC7K70T-2FBG484C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

Xilinx Inc.

Click Purchase button to buy original genuine XC7K70T-2FBG484C

Purchase 

Description:

IC FPGA 285 I/O 484FCBGA

Datasheet:

XC7K70T-2FBG484C Datasheet

Package:

BGA484

Quantity:

88 PCS


XC7K70T-2FBG484C Images are for reference only.

XC7K70T-2FBG484C Image 


CAD Models

 XC7K70T-2FBG484C Symbol

XC7K70T-2FBG484C Symbol

XC7K70T-2FBG484C Footprint 

XC7K70T-2FBG484C Footprint


Product Attributes

Categories

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array)

Manufacturer

Xilinx Inc.

Series

Kintex®-7

Base Part Number

XC7K70T

Package Description

FBGA-484

REACH Compliant

Yes

Status

NRND

Programmable Logic Type

FIELD PROGRAMMABLE GATE ARRAY

Clock Frequency-Max

1,286 MHz

Combinatorial Delay of a CLB-Max

0.61 ns

Clock Management

MMCM, PLL

Distributed RAM  

838 kbit

Dedicated DSP  

240

Device Number of DLLs/PLLs

6

Embedded Block RAM - EBR

4860 kbit

In System Programmability

Yes

JESD-30 Code

S-PBGA-B484

JESD-609 Code

e1

Lead Finish

Tin/Silver/Copper

Maximum Number of User I/Os

185

Max Processing Temp

250

Number of CLBs

5,125

Number of Inputs

185

Number of Logic Cells

65,600

Number of Logic Units

41,000

Number of Outputs  

185

Number of Terminals

484

Number of Transceivers

8

Number of Reflow Cycle

3

Number of I/O

285

Number of Logic Blocks (LABs)

5,125

Number of Registers

82,000

Operating Temperature

0°C ~ 85°C (TJ)

Organization

5125 CLBS

Operating Supply Voltage

1 V

Package Body Material

PLASTIC

Package Code

BGA

PCI Blocks

1

Process Technology

28 nm

Product Range

Kintex-7 XC7K70T Series

Program Memory Type

SRAM

Package Type

FCBGA

Package Equivalence Code

BGA, BGA484,22X22,40

Package Shape

SQUARE

Product Dimensions

23 x 23 mm

Product Type

FPGA - Field Programmable Gate Array

Programmability

Yes

Package Style

GRID ARRAY

Packaging

Tray

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Power Supplies

1,1.8,3.3 V

Pin Count

484

PCB

484

Pbfree Code

Yes

Package / Case

484-BBGA, FCBGA

Supplier Device Package

484-FCBGA (23x23)

Qualification Status  

Not Qualified

RAM Bits

4,976,640 b

Rohs Code

Yes

Re-programmability Support

Yes

Risk Rank

2.27

Reflow Solder Time (Sec)

30

Radiation Hardening

No

Supply Voltage-Nom

1.0 V

Supply Voltage-Min

0.97 V

Supply Voltage-Max

1.03 V

Screening Level

Industrial

Sub Category

Programmable Logic ICs

Screening Level

Commercial

Seated Height-Max

2.54 mm

Surface Mount  

Yes

Speed Grade

2

Technology

CMOS

Temperature Grade

OTHER

Terminal Form

Ball

Terminal Pitch  

1.0 mm

Terminal Position

Bottom

Transceiver Speed

12.5Gbps

Total Number of Block RAM

135

Terminal Finish

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Tradename

Kintex

Height

1.84 mm

Length

23 mm

Width

23 mm


Features

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.

  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.

  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.

  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.

  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.

  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.

  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.

  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.


Advantages and Disadvantages

Advantages

Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.


Applications

There is no relevant information available for this part yet.


Product Functions

There is no relevant information available for this part yet.


ECCN / UNSPSC

Description

Value

ECCN

3A991.D

HTSN

8542.39.00.01


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant


Documents & Media

There is no relevant information available for this part yet.


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributor

Stock

Manufacturer

Descriptions

Kynix Semiconductor

88 PCS

Xilinx, Inc.

IC FPGA 285 I/O 484FCBGA

Digi-Key

84 PCS

Xilinx, Inc.

IC FPGA 285 I/O 484FCBGA

Avnet

Americas - 0

Europe - 54

Asia - 25

Xilinx, Inc.

FPGA Kintex-7 Family 65600 Cells 28nm Technology 1V 484-Pin Lidless FCBGA (Alt: XC7K70T-2FBG484C)

Mouser

60 PCS

Xilinx, Inc.

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


You May Also Be Interested In

Part Number

Manufacturer

Package

Quantity

Description

XC7K480T-L2FF1156E

Xilinx Inc.

BGA

88 PCS

-

XC5VLX30-2FF324C

Xilinx Inc.

BGA324

336 PCS

IC FPGA 220 I/O 324FBGA

XC7K480T-L2FFG1156E

Xilinx Inc.

BGA

88 PCS

IC FPGA 400 I/O 1156FCBGA

XC7K480T-3FFG1156E

Xilinx Inc.

BGA

88 PCS

IC FPGA 400 I/O 1156FCBGA

MC9S08QA2CFQE

NXP

8-VDFN Exposed Pad

25275 PCS

IC MCU 8BIT 2KB FLASH 8QFN

XC7K480T-L2FFG901E

Xilinx Inc.

BGA

88 PCS

IC FPGA 380 I/O 901FCBGA



0 comment

Leave a Reply

Your email address will not be published.

 
 
   
Rating: