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Aug 12 2019

XC3S400AN-4FGG400I Datasheets| XILINX| PDF| Price| In Stock


Product Overview

Kynix Part#:

KY32-XC3S400AN-4FGG400I

Manufacturer Part#:

XC3S400AN-4FGG400I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

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XC3S400AN-4FGG400I

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Description:

-

Datasheet:

XC3S400AN-4FGG400I Datasheet

Package:

BGA

Quantity:

333 PCS


XC3S400AN-4FGG400I Images are for reference only:

XC3S400AN-4FGG400I


CAD Models

XC3S400AN-4FGG400I Symbol

XC3S400AN-4FGG400I Symbol

XC3S400AN-4FGG400I Footprint

XC3S400AN-4FGG400I Footprint


Product Attributes

Manufacturer:

Xilinx

Product Category:

IC Chips

Status:

Active

Series:

Spartan®-3AN

Clock Frequency-Max:

280.0 MHz

Distributed RAM:

56 kbit

Device Logic Cells:

8,064

Device Logic Units:

8,064

EU RoHS Compliant:

Yes

Embedded Block RAM - EBR:

360 kbit

In System Programmability:

Yes

.JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

21.0 mm

Lead Finish:

Tin/Silver/Copper

Mounting Type:

Surface Mount

Mounting Style:

SMD/SMT

Maximum Operating Frequency:

250 MHz

Max Processing Temp:

250

Number of I/O:

311

Number of CLBs:

896.0

Number of Gates:

400000

Number of Inputs:

311.0

Number of Outputs:

248.0

Number of Terminals:

400

Number of Logic Cells:

8064

Organization:

896 CLBS, 400000 GATES

Operating Temperature-Min:

-40.0 °C

Operating Temperature-Max:

100.0 °C

Pin Count:

400

Product Type:

FPGA - Field Programmable Gate Array

Package / Case:

400-BGA

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA400,20X20,40

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

250

RAM Bits:

368,640 Bit

REACH Compliant:

Yes

Speed Grade:

4

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Screening Level:

Industrial

Seated Height-Max:

2.43 mm

Supply Voltage-Nom:

1.2 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Max:

1.26 V

Supplier Device Package:

400-FBGA (21x21)

Tradename:

Spartan

Technology :

CMOS

Total RAM Bits:

368640

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30

Voltage - Supply:

1.14V ~ 1.26V

Width:

21.0 mm


Product Features

• Very low-cost, high-performance logic solution for highvolume, cost-conscious applications

• Low-cost QFP and BGA packaging, Pb-free options

• Flexible power management

• Leading connectivity platform

• Abundant, flexible logic resources

• Dedicated resources for high-speed digital signal processing applications

• Precise clock management with up to eight Digital Clock Managers (DCMs)

• Integrated flash memory in Spartan-3AN devices

• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing

• Hierarchical SelectRAM™ memory architecture

• Configuration interface to industry-standard PROMs

• Complete Xilinx® ISE® and free WebPACK™ development system software support

• MicroBlaze™ and PicoBlaze™ embedded processors reduce risk

• Low-cost starter kits from Xilinx, distributors, and third parties

• XA versions available for Automotive applications


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991.D

HTSN:

8542390001

SCHEDULE B:

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

USHTS:

8542390001

TARIC:

8542399000

Documents & Media

Datasheets

Spartan-3AN FPGA Datasheet

Spartan-3AN Brochure

Extended Spartan-3A Family Overview

Spartan-3AN FPGA User Guide

Product Training Modules

Extended Spartan 3A FPGA Family

Design Resources

Development Tool Selector


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

333

XILINX

-

DigiKey

0

Xilinx Inc.

IC FPGA 311 I/O 400FBGA

Mouser

120

Xilinx

FPGA - Field Programmable Gate Array XC3S400AN-4FGG400I


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

There is no relevant information available for this part yet.


Market Price Analysis

There is no relevant information available for this part yet.


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