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XC3S200AN-4FTG256I Datasheets| XILINX| PDF| Price| In Stock

Author: Apogeeweb
Date: 12 Aug 2019
 1896
IC Chips


Product Overview

Kynix Part#:

KY32-XC3S200AN-4FTG256I

Manufacturer Part#:

XC3S200AN-4FTG256I

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

Click Purchase button to buy original genuine

XC3S200AN-4FTG256I

purchase

Description:

IC FPGA 195 I/O 256FTBGA

Datasheet:

XC3S200AN-4FTG256I Datasheet

Package:

-

Quantity:

7028 PCS


XC3S200AN-4FTG256I Images are for reference only:

XC3S200AN-4FTG256I


CAD Models

XC3S200AN-4FTG256I Symbol

XC3S200AN-4FTG256I Symbol

XC3S200AN-4FTG256I Footprint

XC3S200AN-4FTG256I Footprint


Product Attributes

Manufacturer:

Xilinx

Product Category:

IC Chips

Status:

Active

Series:

Spartan®-3AN

Clock Frequency-Max:

280.0 MHz

Distributed RAM:

28 kbit

EU RoHS Compliant:

Yes

Embedded Block RAM - EBR:

288 kbit

.JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17.0 mm

Mounting:

Surface Mount

Mounting Style:

SMD/SMT

Maximum Operating Frequency:

250 MHz

Number of I/O:

195

Number of CLBs:

448.0

Number of Gates:

200000

Number of Inputs:

195.0

Number of Outputs:

160.0

Number of Terminals:

256

Number of Logic Cells:

4032

Organization:

448 CLBS, 200000 GATES

Operating Temperature-Min:

-40.0 °C

Operating Temperature-Max:

100.0 °C

Pin Count:

256

Product Type:

FPGA - Field Programmable Gate Array

Package / Case:

256-LBGA

Package Code:

LBGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE, LOW PROFILE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA256,16X16,40

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

260

RAM Bits:

294,912 Bit

REACH Compliant:

Yes

Speed Grade:

4

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Screening Level:

Industrial

Seated Height-Max:

1.5 mm

Supply Voltage-Nom:

1.20V

Supply Voltage-Min:

1.14 V

Supply Voltage-Max:

1.26 V

Supplier Device Package:

256-FTBGA (17x17)

Temperature Grade:

INDUSTRIAL

Tradename:

Spartan

Technology :

CMOS

Total RAM Bits:

294912

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30

Voltage - Supply:

1.14V ~ 1.26V

Width:

17.0 mm


Product Features

• Very low-cost, high-performance logic solution for highvolume, cost-conscious applications

• Low-cost QFP and BGA packaging, Pb-free options

• Flexible power management

• Leading connectivity platform

• Abundant, flexible logic resources

• Dedicated resources for high-speed digital signal processing applications

• Precise clock management with up to eight Digital Clock Managers (DCMs)

• Integrated flash memory in Spartan-3AN devices

• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing

• Hierarchical SelectRAM™ memory architecture

• Configuration interface to industry-standard PROMs

• Complete Xilinx® ISE® and free WebPACK™ development system software support

• MicroBlaze™ and PicoBlaze™ embedded processors reduce risk

• Low-cost starter kits from Xilinx, distributors, and third parties

• XA versions available for Automotive applications


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

EAR99

HTSN:

8542390001

SCHEDULE B:

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

USHTS:

8542390001

TARIC:

8542399000


Documents & Media

Datasheets

Spartan-3AN FPGA Datasheet

Spartan-3AN Brochure

Extended Spartan-3A Family Overview

Product Training Modules

Extended Spartan 3A FPGA Family

Design Resources

Development Tool Selector

PCN Packaging

Spartan-3A, 3AN Devices 20/Oct/2008


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

7028

XILINX

IC FPGA 195 I/O 256FTBGA

DigiKey

251

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

Mouser

269

Xilinx

FPGA - Field Programmable Gate Array XC3S200AN-4FTG256I


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC3S200AN-4FTG256I Popularity by Region

XC3S200AN-4FTG256I Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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