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Aug 6 2019

XC4VSX25-10FFG668C Datasheets| XILINX| PDF| Price| In Stock


Product Overview

Kynix Part#:

KY32-XC4VSX25-10FFG668C

Manufacturer Part#:

XC4VSX25-10FFG668C

Product Category:

IC Chips

Stock:

Yes

Manufacturer:

XILINX

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XC4VSX25-10FFG668C

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Description:

IC FPGA 320 I/O 668FCBGA

Datasheet:

XC4VSX25-10FFG668C Datasheet

Package:

BGA668

Quantity:

956 PCS


XC4VSX25-10FFG668C Images are for reference only:

XC4VSX25-10FFG668C


CAD Models

XC4VSX25-10FFG668C Symbol

XC4VSX25-10FFG668C Symbol

XC4VSX25-10FFG668C Footprint

XC4VSX25-10FFG668C Footprint


Product Attributes

Manufacturer:

XILINX

Product Category:

IC Chips

Status:

Active

Series:

Virtex®-4 SX

Clock Frequency-Max:

1028.0 MHz

Distributed RAM:

160 kbit

Device Logic Cells:

23,040

Device Logic Units:

23,040

EU RoHS Compliant:

Yes

Embedded Block RAM - EBR:

2304 kbit

In System Programmability:

No

.JESD-30 Code:

S-PBGA-B668

JESD-609 Code:

e1

Length:

27.0 mm

Lead Finish:

Tin/Silver/Copper

Mounting Type:

Surface Mount

Mounting Style:

SMD/SMT

Maximum Operating Frequency:

500 MHz

Max Processing Temp:

250

Number of I/O:

320

Number of CLBs:

2560.0

Number of Inputs:

320.0

Number of Outputs:

320.0

Number of Terminals:

668

Number of Logic Cells:

23040

Organization:

2560 CLBS

Operating Temperature-Min:

0.0 °C

Operating Temperature-Max:

85.0 °C

Pin Count:

668

Product Type:

FPGA - Field Programmable Gate Array

Package / Case:

668-BBGA, FCBGA

Package Code:

BGA

Package Style:

GRID ARRAY

Package Shape:

SQUARE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

BGA668,26X26,40

Programmable Logic Type:

FIELD PROGRAMMABLE GATE ARRAY

Peak Reflow Temperature:

245

RAM Bits:

2,359,296 Bit

REACH Compliant:

Yes

Speed Grade:

10

Sub Category:

Field Programmable Gate Arrays

Surface Mount:

Yes

Screening Level:

Commercial

Supply Voltage-Nom:

1.2 V

Supply Voltage-Min:

1.14 V

Supply Voltage-Max:

1.26 V

Supplier Device Package:

668-FCBGA (27x27)

Tradename:

Virtex

Technology :

CMOS

Total RAM Bits:

2359296

Terminal Form:

BALL

Terminal Pitch:

1.0 mm

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Position:

BOTTOM

Time@Peak Reflow Temperature-Max:

30

Voltage - Supply:

1.14V ~ 1.26V

Width:

27.0 mm


Product Features

• Three Families — LX/SX/FX

- Virtex-4 LX: High-performance logic applications solution

- Virtex-4 SX: High-performance solution for digital signal processing (DSP) applications

- Virtex-4 FX: High-performance, full-featured solution for embedded platform applications

• Xesium™ Clock Technology

- Digital clock manager (DCM) blocks

- Additional phase-matched clock dividers (PMCD)

- Differential global clocks

• XtremeDSP™ Slice

- 18 x 18, two’s complement, signed Multiplier

- Optional pipeline stages

- Built-in Accumulator (48-bit) and Adder/Subtracter

• Smart RAM Memory Hierarchy

- Distributed RAM

- Dual-port 18-Kbit RAM blocks

· Optional pipeline stages

· Optional programmable FIFO logic automatically remaps RAM signals as FIFO signals

- High-speed memory interface supports DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.

• SelectIO™ Technology

- 1.5V to 3.3V I/O operation

- Built-in ChipSync™ source-synchronous technology

- Digitally controlled impedance (DCI) active termination

- Fine grained I/O banking (configuration in one bank)

• Flexible Logic Resources

• Secure Chip AES Bitstream Encryption

• 90 nm Copper CMOS Process

• 1.2V Core Voltage

• Flip-Chip Packaging including Pb-Free Package Choices

• RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-Gigabit Transceiver (MGT) [FX only]

• IBM PowerPC RISC Processor Core [FX only]

- PowerPC 405 (PPC405) Core

- Auxiliary Processor Unit Interface (User Coprocessor)

• Multiple Tri-Mode Ethernet MACs [FX only]


Product Functions

There is no relevant information available for this part yet.


Applications

There is no relevant information available for this part yet.


Advantages and Disadvantages

There is no relevant information available for this part yet.


ECCN / UNSPSC

ECCN:

3A991.d

HTSN:

8542390001

SCHEDULE B:

8542390000


Environmental & Export Classifications

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant


Product Compliance

USHTS:

8542390001

TARIC:

8542399000


Documents & Media

Datasheets

Virtex-4 Family Overview

Design Resources

Development Tool Selector

EDA / CAD Models

Download from Ultra Librarian


Product Manufacturer

Xilinx, Inc. is an American technology company and is primarily a supplier of programable logic devices. It is known for inventing the field-programming gate array and as the semicondcutot company that created the first fabless manufacturing model. Ross Freeman, Bernard Vonderschmitt, and James V Barnett II, former employees of Zilog, an integrated circuit and solid-state device manufacturer, co-founded Xilinx in 1984 with headquarters in San Jose, USA.


Product Range

Devices

Boards

Developer Tools

ACAPs

Accelerator Cards

Vivado Design Suite - HLx Editions

FPGAs & 3D ICs

Evaluation Boards

SDAccel Development Environment

SoCs, MPSoCs & RFSoCs

System-on-Modules (SoMs)

SDSoC Development Environment


Distributors

Distributors

Stock

Manufacturers

Descriptions

Kynix

956

XILINX

IC FPGA 320 I/O 668FCBGA

DigiKey

0

Xilinx Inc.

IC FPGA 320 I/O 668FCBGA

Mouser

0

Xilinx

FPGA - Field Programmable Gate Array


Alternative Models

There is no relevant information available for this part yet.


Popularity by Region

XC4VSX25-10FFG668C Popularity by Region

XC4VSX25-10FFG668C Popularity by Region


Market Price Analysis

There is no relevant information available for this part yet.


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